Inventor · disambiguated record
Lawrence P. Lehman
Also filed as: LEHMAN LAWRENCE P · LEHMAN LAWRENCE PHILIP
10 granted patents·122 citations·filing 1996–2006
89Inventor score
Files withIBM10
Top patents by PatentIndex Score
10 records- 0191US7086147B2Method of accommodating in volume expansion during solder reflowIBM·Filed 2004·Granted Aug 8, 2006·40 cites·1 claims
- 0281US6626196B2Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processingIBM·Filed 2001·Granted Sep 30, 2003·23 cites·17 claims
- 0375US6686664B2Structure to accommodate increase in volume expansion during solder reflowIBM·Filed 2001·Granted Feb 3, 2004·15 cites·19 claims
- 0468US6649833B1Negative volume expansion lead-free electrical connectionIBM·Filed 2002·Granted Nov 18, 2003·12 cites·20 claims
- 0560US6190530B1Anode container, electroplating system, method and plated objectIBM·Filed 1999·Granted Feb 20, 2001·13 cites·31 claims
- 0658US7703199B2Method to accommodate increase in volume expansion during solder reflowIBM·Filed 2006·Granted Apr 27, 2010·1 cites·5 claims
- 0742US6179990B1Biased acid cleaning of a copper-invar-copper laminateIBM·Filed 1999·Granted Jan 30, 2001·9 cites·18 claims
- 0838US6228246B1Removal of metal skin from a copper-Invar-copper laminateIBM·Filed 1999·Granted May 8, 2001·7 cites·45 claims
- 0934US6639661B2Technique for imaging electrical contactsIBM·Filed 2001·Granted Oct 28, 2003·0 cites·23 claims
- 1029US5902495AMethod and apparatus for establishing a solder bond to a solder ball grid arrayIBM·Filed 1996·Granted May 11, 1999·2 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →