Inventor · disambiguated record
Larry Leighton
Also filed as: LEIGHTON LARRY · LEIGHTON LARRY C · LEIGHTON LARRY CLIFFORD
21 granted patents·1 pending application·640 citations·filing 1994–2002
96Inventor score
Files withERICSSON INC6ERICSSON TELEFON AB L M5ERICSSON GE MOBILE INC4INFINEON TECHNOLOGIES AG4ERICCSON INC1
Top patents by PatentIndex Score
22 records- 0195US5933327AWire bond attachment of a integrated circuit package to a heat sinkERICSSON GE MOBILE INC·Filed 1998·Granted Aug 3, 1999·220 cites·6 claims
- 0292US6734728B1RF power transistor with internal bias feedINFINEON TECHNOLOGIES CORP·Filed 2002·Granted May 11, 2004·81 cites·28 claims
- 0379US6614308B2Multi-stage, high frequency, high power signal amplifierINFINEON TECHNOLOGIES AG·Filed 2001·Granted Sep 2, 2003·30 cites·27 claims
- 0478US6466094B2Gain and bandwidth enhancement for RF power amplifier packageERICSSON INC·Filed 2001·Granted Oct 15, 2002·28 cites·14 claims
- 0575US6392298B1Functional lid for RF power packageERICSSON INC·Filed 2000·Granted May 21, 2002·24 cites·18 claims
- 0672US6455905B1Single chip push-pull power transistor deviceERICSSON INC·Filed 2001·Granted Sep 24, 2002·18 cites·15 claims
- 0770US5877555ADirect contact die attachERICSSON GE MOBILE INC·Filed 1996·Granted Mar 2, 1999·39 cites·6 claims
- 0867US6806106B2Bond wire tuning of RF power transistors and amplifiersINFINEON TECHNOLOGIES AG·Filed 2001·Granted Oct 19, 2004·16 cites·8 claims
- 0967US6583673B2Stability enhanced multistage power amplifierINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 24, 2003·15 cites·4 claims
- 1064US6777791B2Multiple ground signal path LDMOS power packageINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 17, 2004·14 cites·21 claims
- 1163US6160710ACapacitive mounting arrangement for securing an integrated circuit package to a heat sinkERICSSON INC·Filed 1998·Granted Dec 12, 2000·30 cites·5 claims
- 1259US5907180ABallast monitoring for radio frequency power transistorsERICSSON TELEFON AB L M·Filed 1997·Granted May 25, 1999·25 cites·3 claims
- 1357US5488252ALayout for radio frequency power transistorsTELEFONAKTIEBOLAGET L M ERRICS·Filed 1994·Granted Jan 30, 1996·30 cites·8 claims
- 1455US6181006B1Thermally conductive mounting arrangement for securing an integrated circuit package to a heat sinkERICSSON INC·Filed 1998·Granted Jan 30, 2001·20 cites·16 claims
- 1550US5889319ARF power package with a dual groundERICSSON GE MOBILE INC·Filed 1996·Granted Mar 30, 1999·16 cites·9 claims
- 1649US6239475B1Vertical bipolar transistor having a field shield between the metallic interconnecting layer and the insulation oxideERICSSON TELEFON AB L M·Filed 2000·Granted May 29, 2001·3 cites·7 claims
- 1745US5869897AMounting arrangement for securing an intergrated circuit package to heat sinkERICCSON INC·Filed 1997·Granted Feb 9, 1999·12 cites·13 claims
- 1839US5684326AEmitter ballast bypass for radio frequency power transistorsERICSSON TELEFON AB L M·Filed 1995·Granted Nov 4, 1997·6 cites·10 claims
- 1937US6077753AMethod for manufacturing vertical bipolar transistor having a field shield between an interconnecting layer and the field oxideERICSSON TELEFON AB L M·Filed 1998·Granted Jun 20, 2000·4 cites·11 claims
- 2036US5982000AResistive interconnect of transistor cellsERICSSON INC·Filed 1998·Granted Nov 9, 1999·8 cites·8 claims
- 2134US2003030504A1Tunable impedance matching circuit for RF power amplifierERICSSON TELEFON AB L M·Filed 2001·Application pending·0 cites
- 2225US5804867AThermally balanced radio frequency power transistorERICSSON GE MOBILE INC·Filed 1996·Granted Sep 8, 1998·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →