Inventor · disambiguated record
Law Wai Ling
Also filed as: LING LAW WAI
4 granted patents·1 pending application·6 citations·filing 2011–2013
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0164US8525352B2Short and low loop wire bondingHAR LIEW SIEW·Filed 2011·Granted Sep 3, 2013·3 cites·19 claims
- 0262US8946913B2Short and low loop wire bondingCARSEM M SDN BHD·Filed 2013·Granted Feb 3, 2015·2 cites·19 claims
- 0353US8513819B2Low loop wire bondingHAR LIEW SIEW·Filed 2012·Granted Aug 20, 2013·1 cites·22 claims
- 0446US8941249B2Low loop wire bondingCARSEM M SDN BHD·Filed 2013·Granted Jan 27, 2015·0 cites·20 claims
- 0535US2013200503A1Protective layers in semiconductor packagingMENG CHAN BOON·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Law Wai Ling files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →