Inventor · disambiguated record
Larry M. Mandel
Also filed as: MANDEL LARRY M
9 granted patents·3 pending applications·250 citations·filing 2003–2008
90Inventor score
Top patents by PatentIndex Score
12 records- 0194US7352585B2Flip chip heat sink package and methodDELPHI TECH INC·Filed 2006·Granted Apr 1, 2008·37 cites·16 claims
- 0293US7616448B2Wrap-around overmold for electronic assemblyDELPHI TECH INC·Filed 2007·Granted Nov 10, 2009·43 cites·7 claims
- 0393US7180745B2Flip chip heat sink package and methodDELPHI TECH INC·Filed 2003·Granted Feb 20, 2007·77 cites·10 claims
- 0488US7455552B1Overmolded electronic assembly with metal seal ringDELPHI TECH INC·Filed 2008·Granted Nov 25, 2008·22 cites·7 claims
- 0587US7230829B2Overmolded electronic assembly with insert molded heat sinksDELPHI TECH INC·Filed 2005·Granted Jun 12, 2007·17 cites·19 claims
- 0682US6700195B1Electronic assembly for removing heat from a flip chipDELPHI TECH INC·Filed 2003·Granted Mar 2, 2004·31 cites·20 claims
- 0775US7416011B2Electronic assembly having a substrate laminated within a backplate cavityDELPHI TECH INC·Filed 2005·Granted Aug 26, 2008·7 cites·8 claims
- 0865US6905349B1Technique for connector to printed circuit board decoupling to eliminate flexureDELPHI TECH INC·Filed 2004·Granted Jun 14, 2005·11 cites·14 claims
- 0953US7462077B2Overmolded electronic assemblyDELPHI TECH INC·Filed 2006·Granted Dec 9, 2008·5 cites·7 claims
- 1036US2005077614A1Semiconductor device heat sink package and methodFiled 2003·Application pending·0 cites
- 1135US2009197478A1Interlocking overmold for electronic assemblyMANDEL LARRY M·Filed 2008·Application pending·0 cites
- 1231US2005173152A1Circuit board surface mount packageFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →