Inventor · disambiguated record
Laura Mauer
Also filed as: MAUER LAURA · MAUER LAURA J
11 granted patents·3 pending applications·13 citations·filing 1988–2019
82Inventor score
Top patents by PatentIndex Score
14 records- 0177US9698062B2System and method for performing a wet etching processVEECO PREC SURFACE PROC LLC·Filed 2013·Granted Jul 4, 2017·6 cites·17 claims
- 0276US9541837B2Apparatus and method for removing challenging polymer films and structures from semiconductor wafersVEECO PREC SURFACE PROC LLC·Filed 2013·Granted Jan 10, 2017·5 cites·20 claims
- 0367US10553502B2Two etch method for achieving a wafer thickness profileVEECO PRECISION SURFACE PROC LLC·Filed 2018·Granted Feb 4, 2020·1 cites·17 claims
- 0457US2019168178A1Apparatus and Method for Mixing Fluids with Degradational PropertiesVEECO PRECISION SURFACE PROC LLC·Filed 2019·Application pending·0 cites
- 0551US10239031B2Apparatus and method for mixing fluids with degradational propertiesVEECO PRECISION SURFACE PROC LLC·Filed 2016·Granted Mar 26, 2019·0 cites·18 claims
- 0648US9694436B2System and method for flux coat, reflow and cleanVEECO PREC SURFACE PROC LLC·Filed 2014·Granted Jul 4, 2017·0 cites·17 claims
- 0746US9333446B2Apparatus and method to remove undissolved solids from post process dry film strip solventsVEECO PREC SURFACE PROC LLC·Filed 2013·Granted May 10, 2016·0 cites·21 claims
- 0844US10026660B2Method of etching the back of a wafer to expose TSVsVEECO PRECISION SURFACE PROC LLC·Filed 2015·Granted Jul 17, 2018·0 cites·32 claims
- 0943US10443943B2Apparatus and method to control properties of fluid discharge via refrigerative exhaustVEECO PRECISION SURFACE PROC LLC·Filed 2017·Granted Oct 15, 2019·0 cites·16 claims
- 1041US10541180B2Apparatus and method for wafer thinning in advanced packaging applicationsVEECO PRECISION SURFACE PROC LLC·Filed 2018·Granted Jan 21, 2020·0 cites·31 claims
- 1139US2010051501A1Ic waper carrier sealed from ambient atmosphere during transportation from one process to the nextIBM·Filed 2008·Application pending·0 cites
- 1235US10446387B2Apparatus and method to control etch rate through adaptive spiking of chemistryVEECO PRECISION SURFACE PROC LLC·Filed 2017·Granted Oct 15, 2019·0 cites·23 claims
- 1334US2017287768A1Apparatus and Method to Improve Plasma Dicing and Backmetal Cleaving ProcessVEECO PREC SURFACE PROC LLC·Filed 2017·Application pending·0 cites
- 1425USD316784SFabric featherMAUER LAURA J·Filed 1988·Granted May 14, 1991·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →