Inventor · disambiguated record

Lawrence E. Mckay

Also filed as: MCKAY LAWRENCE E

1 granted patent·60 citations·filing 1997–1997

50Inventor score

Technology areasH10W

Files withINTEL CORP1

Top patents by PatentIndex Score

1 record

0176US5920120AAssembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relievedINTEL CORP·Filed 1997·Granted Jul 6, 1999·60 cites·15 claims

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