Inventor · disambiguated record
Larry L. Moresco
Also filed as: MORESCO LARRY · MORESCO LARRY L · MORESCO LARRY LOUIS
32 granted patents·2,146 citations·filing 1992–2013
98Inventor score
Top patents by PatentIndex Score
32 records- 0198US5334804AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1992·Granted Aug 2, 1994·280 cites·25 claims
- 0296US5854534AControlled impedence interposer substrateFUJITSU LTD·Filed 1995·Granted Dec 29, 1998·238 cites·23 claims
- 0395US6535398B1Multichip module substrates with buried discrete capacitors and components and methods for makingFUJITSU LTD·Filed 2000·Granted Mar 18, 2003·87 cites·22 claims
- 0495US5773889AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1996·Granted Jun 30, 1998·162 cites·20 claims
- 0594US9639126B2Apparatus for cooling a computerINTEL CORP·Filed 2013·Granted May 2, 2017·17 cites·17 claims
- 0694US6733685B2Methods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 2001·Granted May 11, 2004·64 cites·14 claims
- 0794US6111756AUniversal multichip interconnect systemsFUJITSU LTD·Filed 1998·Granted Aug 29, 2000·174 cites·45 claims
- 0892US5514906AApparatus for cooling semiconductor chips in multichip modulesFUJITSU LTD·Filed 1993·Granted May 7, 1996·158 cites·40 claims
- 0992US5426563AThree-dimensional multichip moduleFUJITSU LTD·Filed 1993·Granted Jun 20, 1995·127 cites·28 claims
- 1090US6843421B2Molded memory module and method of making the module absent a substrate supportMATRIX SEMICONDUCTOR INC·Filed 2001·Granted Jan 18, 2005·65 cites·20 claims
- 1190US5655290AMethod for making a three-dimensional multichip moduleFUJITSU LTD·Filed 1995·Granted Aug 12, 1997·105 cites·7 claims
- 1289US5722162AFabrication procedure for a stable postFUJITSU LTD·Filed 1995·Granted Mar 3, 1998·97 cites·16 claims
- 1389US5536362AWire interconnect structures for connecting an integrated circuit to a substrateFUJITSU LTD·Filed 1994·Granted Jul 16, 1996·85 cites·25 claims
- 1487US7086452B1Method and an apparatus for cooling a computerINTEL CORP·Filed 2000·Granted Aug 8, 2006·35 cites·22 claims
- 1586US5404265AInterconnect capacitorsFUJITSU LTD·Filed 1992·Granted Apr 4, 1995·85 cites·16 claims
- 1685US6102710AControlled impedance interposer substrate and method of makingFUJITSU LTD·Filed 1998·Granted Aug 15, 2000·68 cites·18 claims
- 1783US7490656B2Method and an apparatus for cooling a computerINTEL CORP·Filed 2006·Granted Feb 17, 2009·8 cites·24 claims
- 1880US6223814B1Flexible foil finned heatsink structure and method of making sameFUJITSU LTD·Filed 2000·Granted May 1, 2001·28 cites·20 claims
- 1980US5897341ADiffusion bonded interconnectFUJITSU LTD·Filed 1998·Granted Apr 27, 1999·59 cites·30 claims
- 2078US6034332APower supply distribution structure for integrated circuit chip modulesFUJITSU LTD·Filed 1998·Granted Mar 7, 2000·47 cites·13 claims
- 2175US8016023B2Method and an apparatus for cooling a computerINTEL CORP·Filed 2009·Granted Sep 13, 2011·4 cites·12 claims
- 2275US6026895AFlexible foil finned heatsink structure and method of making sameFUJITSU LTD·Filed 1998·Granted Feb 22, 2000·44 cites·57 claims
- 2374US5916453AMethods of planarizing structures on wafers and substrates by polishingFUJITSU LTD·Filed 1996·Granted Jun 29, 1999·38 cites·22 claims
- 2469US8701747B2Method and an apparatus for cooling a computerSENYK BORYS S·Filed 2011·Granted Apr 22, 2014·2 cites·6 claims
- 2565US6404047B1Socketable BGA packageINTEL CORP·Filed 2000·Granted Jun 11, 2002·9 cites·12 claims
- 2660US6539137B1Thermo-electric signal couplerFUJITSU LTD·Filed 2000·Granted Mar 25, 2003·8 cites·15 claims
- 2758US5765279AMethods of manufacturing power supply distribution structures for multichip modulesFUJITSU LTD·Filed 1995·Granted Jun 16, 1998·20 cites·48 claims
- 2848US5930890AStructure and fabrication procedure for a stable postFUJITSU LTD·Filed 1997·Granted Aug 3, 1999·12 cites·10 claims
- 2941US6168976B1Socketable BGA packageINTEL CORP·Filed 1999·Granted Jan 2, 2001·7 cites·27 claims
- 3036US6324436B1Method for optimizing cost of manufacturing memory arraysFUJITSU LTD·Filed 1998·Granted Nov 27, 2001·8 cites·9 claims
- 3135US6798076B2Method and apparatus for encoding information in an IC packageINTEL CORP·Filed 1999·Granted Sep 28, 2004·4 cites·14 claims
- 3231US6221459B1Controlling the heat expansion of electrical couplingsINTEL CORP·Filed 1998·Granted Apr 24, 2001·1 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →