Inventor · disambiguated record
Laszlo Nobi
Also filed as: NOBI LASZLO
4 granted patents·1 pending application·227 citations·filing 1991–2003
82Inventor score
Top patents by PatentIndex Score
5 records- 0188US6330745B1Method for making a modular integrated apparatus for heat dissipationHEWLETT PACKARD CO·Filed 2000·Granted Dec 18, 2001·53 cites·7 claims
- 0287US6061235AMethod and apparatus for a modular integrated apparatus for heat dissipation, processor integration, electrical interface, and electromagnetic interference managementHEWLETT PACKARD CO·Filed 1998·Granted May 9, 2000·89 cites·7 claims
- 0385US5086269ABurn-in process and apparatusHEWLETT PACKARD CO·Filed 1991·Granted Feb 4, 1992·72 cites·17 claims
- 0463US6791184B2Support assembly for an integrated circuit package having solder columnsHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Sep 14, 2004·13 cites·40 claims
- 0530US2004134680A1Use of perimeter stops to support solder interconnects between integrated circuit assembly componentsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →