Inventor · disambiguated record
Lan Peng
Also filed as: PENG LAN · PENG LAN QIAN
4 granted patents·9 pending applications·11 citations·filing 2015–2025
64Inventor score
Top patents by PatentIndex Score
13 records- 0187US10886252B2Method of bonding semiconductor substratesIMEC VZW·Filed 2018·Granted Jan 5, 2021·8 cites·20 claims
- 0274US9632917B2Software testingIBM·Filed 2015·Granted Apr 25, 2017·3 cites·15 claims
- 0365US2024411003A1Distance measurement method, readable medium, and electronic deviceHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0463US2024248163A1Method for directing user and electronic deviceHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0562US2025314732A1Orientation measurement method and terminal deviceHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 0661US2024418843A1Distance measurement method, apparatus, and system, and readable storage mediumHUAWEI TECH CO LTD·Filed 2024·Application pending·0 cites
- 0756US2024112944A1Process for Wafer BondingIMEC VZW·Filed 2023·Application pending·0 cites
- 0854US2023156657A1Multipath Single-Anchor Positioning Method and Communication ApparatusHUAWEI TECH CO LTD·Filed 2023·Application pending·0 cites
- 0948US2024015744A1Communication Method and Apparatus, Chip, Storage Medium, and Program ProductHUAWEI TECH CO LTD·Filed 2021·Application pending·0 cites
- 1046US12501455B2Resource processing method, apparatus, and mediumHUAWEI TECH CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 1142US2021089617A1Pasting based on semantic fragmentsIBM·Filed 2019·Application pending·0 cites
- 1238US10141284B2Method of bonding semiconductor substratesIMEC VZW·Filed 2017·Granted Nov 27, 2018·0 cites·18 claims
- 1337US2021005444A1Method for manufacturing a silicon on nitride substrateIMEC VZW·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →