Inventor · disambiguated record
Laxminarayan Sharma
Also filed as: SHARMA LAXMINARAYAN
10 granted patents·1 pending application·163 citations·filing 1997–2018
89Inventor score
Files withMOTOROLA INC3APPLIED MICRO CIRCUITS CORP2QUALCOMM INC2SILANNA ASIA PTE LTD2ENTROPIC COMMUNICATIONS INC1
Top patents by PatentIndex Score
11 records- 0179US7872356B2Die stacking system and methodQUALCOMM INC·Filed 2007·Granted Jan 18, 2011·11 cites·39 claims
- 0273US6566761B1Electronic device package with high speed signal interconnect between die pad and external substrate padAPPLIED MICRO CIRCUITS CORP·Filed 2002·Granted May 20, 2003·22 cites·21 claims
- 0371US7602050B2Integrated circuit packagingQUALCOMM INC·Filed 2006·Granted Oct 13, 2009·5 cites·29 claims
- 0469US5962926ASemiconductor device having multiple overlapping rows of bond pads with conductive interconnects and method of pad placementMOTOROLA INC·Filed 1997·Granted Oct 5, 1999·43 cites·16 claims
- 0568US5990547ASemiconductor device having plated contacts and method thereofMOTOROLA INC·Filed 1998·Granted Nov 23, 1999·38 cites·8 claims
- 0663US6574861B1System and method for solder ball reworkAPPLIED MICRO CIRCUITS CORP·Filed 2001·Granted Jun 10, 2003·10 cites·34 claims
- 0763US5898213ASemiconductor package bond post configurationMOTOROLA INC·Filed 1997·Granted Apr 27, 1999·34 cites·21 claims
- 0853US10490489B2Conductive clip connection arrangements for semiconductor packagesSILANNA ASIA PTE LTD·Filed 2018·Granted Nov 26, 2019·0 cites·15 claims
- 0950US10128170B2Conductive clip connection arrangements for semiconductor packagesSILANNA ASIA PTE LTD·Filed 2017·Granted Nov 13, 2018·0 cites·24 claims
- 1037US2011115063A1Integrated Circuit Packaging with Split PaddleENTROPIC COMMUNICATIONS INC·Filed 2010·Application pending·0 cites
- 1136US9159694B2Die stacking system and methodSANCHEZ HENRY·Filed 2010·Granted Oct 13, 2015·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →