Inventor · disambiguated record
Lance L. Sundstrom
Also filed as: SUNDSTROM LANCE · SUNDSTROM LANCE L · SUNDSTROM LANCE LEROY
25 granted patents·8 pending applications·578 citations·filing 1994–2017
96Inventor score
Top patents by PatentIndex Score
33 records- 0196US6414248B1Compliant attachment interfaceHONEYWELL INT INC·Filed 2000·Granted Jul 2, 2002·105 cites·18 claims
- 0294US5602494ABi-directional programmable I/O cellHONEYWELL INC·Filed 1995·Granted Feb 11, 1997·107 cites·22 claims
- 0392US5528172AAdjustable voltage level shifterHONEYWELL INC·Filed 1994·Granted Jun 18, 1996·71 cites·16 claims
- 0491US7830164B2Ducted test socketHONEYWELL INT INC·Filed 2008·Granted Nov 9, 2010·68 cites·20 claims
- 0590US7462939B2Interposer for compliant interfacial couplingHONEYWELL INT INC·Filed 2005·Granted Dec 9, 2008·20 cites·25 claims
- 0687US5864177ABypass capacitors for chip and wire circuit assemblyHONEYWELL INC·Filed 1996·Granted Jan 26, 1999·87 cites·11 claims
- 0784US8009429B1Electrical component thermal managementHONEYWELL INT INC·Filed 2010·Granted Aug 30, 2011·11 cites·20 claims
- 0884US7787249B2Systems and methods for printed board assembly isolated heat exchangeHONEYWELL INT INC·Filed 2009·Granted Aug 31, 2010·11 cites·20 claims
- 0981US8223497B2Thermal bridge extensions for a module-chassis interfaceSUNDSTROM LANCE LEROY·Filed 2009·Granted Jul 17, 2012·18 cites·20 claims
- 1081US7016176B1Low ESL and ESR chip capacitorHONEYWELL INT INC·Filed 2005·Granted Mar 21, 2006·11 cites·26 claims
- 1176US8203410B2Inductor assemblySUNDSTROM LANCE L·Filed 2010·Granted Jun 19, 2012·6 cites·20 claims
- 1274US7557425B2Package cap with bypass capacitanceHONEYWELL INT INC·Filed 2005·Granted Jul 7, 2009·6 cites·27 claims
- 1373US7120048B2Nonvolatile memory vertical ring bit and write-read structureHONEYWELL INT INC·Filed 2004·Granted Oct 10, 2006·20 cites·27 claims
- 1471US9946284B1Single event effects immune linear voltage regulatorHONEYWELL INT INC·Filed 2017·Granted Apr 17, 2018·2 cites·20 claims
- 1568US5764498AElectronics assembly formed with a slotted coupling device that absorbs mechanical forces, such as vibration and mechanical shockHONEYWELL INC·Filed 1997·Granted Jun 9, 1998·24 cites·9 claims
- 1667US9111915B1Thermal conduction coolingHONEYWELL INT INC·Filed 2014·Granted Aug 18, 2015·2 cites·20 claims
- 1756US7724566B1Magnetoresistive resistor memory cellUS NAVY·Filed 2008·Granted May 25, 2010·3 cites·2 claims
- 1852US7354305B2Area array device test adapterHONEYWELL INT INC·Filed 2005·Granted Apr 8, 2008·4 cites·21 claims
- 1948US7476570B2System and method of attaching an integrated circuit assembly to a printed wiring boardHONEYWELL INT INC·Filed 2006·Granted Jan 13, 2009·0 cites·20 claims
- 2048US7046520B2Electronic assemblies having supports for circuit boardsHONEYWELL INT INC·Filed 2003·Granted May 16, 2006·2 cites·21 claims
- 2144US8748750B2Printed board assembly interface structuresSUNDSTROM LANCE L·Filed 2011·Granted Jun 10, 2014·0 cites·23 claims
- 2244US2006215336A1ESD foam ground clipHONEYWELL INT INC·Filed 2005·Application pending·0 cites
- 2344US2006146459A1ESD component ground clipHONEYWELL INT INC·Filed 2005·Application pending·0 cites
- 2443US2014198820A1Systems and methods for an auto-ranging temperature sensorHONEYWELL INT INC·Filed 2013·Application pending·0 cites
- 2542US2007096857A1Helmholtz coil systemHONEYWELL INT INC·Filed 2005·Application pending·0 cites
- 2642US2007290321A1Die stack capacitors, assemblies and methodsHONEYWELL INT INC·Filed 2006·Application pending·0 cites
- 2740US2006220191A1Electronic package with a stepped-pitch leadframeHONEYWELL INT INC·Filed 2005·Application pending·0 cites
- 2839US8094490B1Nonvolatile loop magnetic memorySUNDSTROM LANCE L·Filed 2009·Granted Jan 10, 2012·0 cites·8 claims
- 2939US7613058B2Radiation hardening, detection and protection design methods and circuit examples thereofHONEYWELL INT INC·Filed 2005·Granted Nov 3, 2009·0 cites·22 claims
- 3037US8416613B1Magnetoresistive bridge nonvolatile memory deviceSUNDSTROM LANCE L·Filed 2011·Granted Apr 9, 2013·0 cites·2 claims
- 3135US2002066523A1Attaching devices using polymersFiled 2000·Application pending·0 cites
- 3234US2009267631A1Large Component Thermal Head AdapterHONEYWELL INT INC·Filed 2008·Application pending·0 cites
- 3330US5986496AIntegrated circuit having programmable bias circuitsHONEYWELL INC·Filed 1997·Granted Nov 16, 1999·0 cites·4 claims
Join the waitlist — get patent alerts
Get an alert when Lance L. Sundstrom files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →