Inventor · disambiguated record
Lance Swan
Also filed as: SWAN LANCE
2 granted patents·32 citations·filing 2006–2011
58Inventor score
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0188US7972650B1Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnectionsNSCRYPT INC·Filed 2006·Granted Jul 5, 2011·31 cites·30 claims
- 0256US8790742B2Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnectionsCHURCH KENNETH H·Filed 2011·Granted Jul 29, 2014·1 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →