Inventor · disambiguated record
Lai Guan Tang
Also filed as: TANG LAI GUAN
26 granted patents·12 pending applications·65 citations·filing 2010–2025
94Inventor score
Top patents by PatentIndex Score
38 records- 0195US12009298B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2023·Granted Jun 11, 2024·2 cites·20 claims
- 0295US11670589B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2020·Granted Jun 6, 2023·4 cites·20 claims
- 0394US10886218B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2019·Granted Jan 5, 2021·12 cites·20 claims
- 0493US11036660B2Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devicesINTEL CORP·Filed 2019·Granted Jun 15, 2021·19 cites·20 claims
- 0591US12026008B2Techniques for clock signal transmission in integrated circuits and interposersINTEL CORP·Filed 2022·Granted Jul 2, 2024·1 cites·19 claims
- 0691US11216397B2Translation circuitry for an interconnection in an active interposer of a semiconductor packageINTEL CORP·Filed 2019·Granted Jan 4, 2022·6 cites·20 claims
- 0790US11726932B2Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devicesINTEL CORP·Filed 2021·Granted Aug 15, 2023·2 cites·20 claims
- 0889US11080449B2Modular periphery tile for integrated circuit deviceINTEL CORP·Filed 2020·Granted Aug 3, 2021·2 cites·20 claims
- 0988US12334449B2Selective use of different advanced interface bus with electronic chipsINTEL CORP·Filed 2020·Granted Jun 17, 2025·2 cites·20 claims
- 1087US2025077753A1Modular periphery tile for integrated circuit deviceALTERA CORP·Filed 2024·Application pending·0 cites
- 1186US10642946B2Modular periphery tile for integrated circuit deviceINTEL CORP·Filed 2018·Granted May 5, 2020·3 cites·17 claims
- 1285US12394713B2Fabric die to fabric die interconnect for modularized integrated circuit devicesINTEL CORP·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1382US12153866B2Modular periphery tile for integrated circuit deviceINTEL CORP·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 1478US11500412B2Techniques for clock signal transmission in integrated circuits and interposersINTEL CORP·Filed 2019·Granted Nov 15, 2022·2 cites·16 claims
- 1577US12425030B2Systems and methods for configurable interface circuitsINTEL CORP·Filed 2021·Granted Sep 23, 2025·1 cites·20 claims
- 1675US11714941B2Modular periphery tile for integrated circuit deviceINTEL CORP·Filed 2021·Granted Aug 1, 2023·0 cites·20 claims
- 1775US11528029B2Apparatus to synchronize clocks of configurable integrated circuit dies through an interconnect bridgeINTEL CORP·Filed 2018·Granted Dec 13, 2022·2 cites·20 claims
- 1872US11621713B2High-speed core interconnect for multi-die programmable logic devicesINTEL CORP·Filed 2021·Granted Apr 4, 2023·0 cites·20 claims
- 1972US2025285985A1Selective use of different advanced interface bus with electronic chipsALTERA CORP·Filed 2025·Application pending·0 cites
- 2070US11669472B2Frequency translation circuitry for an interconnection in an active interposer of a semiconductor packageINTEL CORP·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 2169US10211833B2Techniques for power control of circuit blocksALTERA CORP·Filed 2016·Granted Feb 19, 2019·2 cites·20 claims
- 2268US11128301B2High-speed core interconnect for multi-die programmable logic devicesINTEL CORP·Filed 2020·Granted Sep 21, 2021·0 cites·20 claims
- 2364US8780121B2Graphics render clock throttling and gating mechanism for power savingCHONG LAI KUAN·Filed 2010·Granted Jul 15, 2014·5 cites·24 claims
- 2458US10666261B2High-speed core interconnect for multi-die programmable logic devicesINTEL CORP·Filed 2018·Granted May 26, 2020·0 cites·20 claims
- 2557US2023342309A1Circuit Systems And Methods For Transmitting Signals Between DevicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2653US2023028475A1Package io escape routing on a disaggregated shorelineNALAMALPU ANKIREDDY·Filed 2022·Application pending·0 cites
- 2753US2023024662A1Die-to-Die Power DeliveryNALAMALPU ANKIREDDY·Filed 2022·Application pending·0 cites
- 2851US2022336415A1Grid-based interconnect system for modular integrated circuit systemsTANG LAI GUAN·Filed 2022·Application pending·0 cites
- 2951US2022337251A1Systems and methods for modular disaggregated integrated circuit systemsNALAMALPU ANKIREDDY·Filed 2022·Application pending·0 cites
- 3048US10177753B2Techniques for generating pulse-width modulation dataALTERA CORP·Filed 2016·Granted Jan 8, 2019·0 cites·20 claims
- 3148US2023042718A1Die-to-Die Interconnect Architecture for Hardware-Agnostic ModelingNALAMALPU ANKIREDDY·Filed 2022·Application pending·0 cites
- 3248US2022337248A1Programmable routing bridgeINTEL CORP·Filed 2022·Application pending·0 cites
- 3347US11062070B2Die to die interconnect structure for modularized integrated circuit devicesINTEL CORP·Filed 2019·Granted Jul 13, 2021·0 cites·13 claims
- 3447US2022224342A1Clocking architecture for a multi-die packageMAHESHWARI ATUL·Filed 2022·Application pending·0 cites
- 3546US2022229941A1Security on die-to-die interconnectTANG LAI GUAN·Filed 2022·Application pending·0 cites
- 3636US10382013B2Pulse-width modulation voltage identification interfaceALTERA CORP·Filed 2016·Granted Aug 13, 2019·0 cites·20 claims
- 3736US2022337250A1Three-Dimensional Columnar Input-Output (IO) Circuitry for Integrated Circuit DeviceKUMASHIKAR MAHESH K·Filed 2022·Application pending·0 cites
- 3835US11336286B2Scalable micro bumps indexing and redundancy scheme for homogeneous configurable integrated circuit diesINTEL CORP·Filed 2018·Granted May 17, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →