Inventor · disambiguated record
Leu-Jen Chen
Also filed as: CHEN LEU-JEN
2 granted patents·1 pending application·8 citations·filing 2019–2023
54Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0190US10790254B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·6 cites·20 claims
- 0289US10985125B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 0357US2025105169A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →