Inventor · disambiguated record
Lewis M. Eyman
Also filed as: EYMAN LEWIS M · EYMAN LEWIS MICHAEL
3 granted patents·1 pending application·221 citations·filing 2000–2002
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0191US6639800B1Heat sink subassemblyADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 28, 2003·127 cites·57 claims
- 0285US6504243B1Removable heat transfer apparatus for a pin grid array (PGA) device, and associated installation and removal methodsADVANCED MICRO DEVICES INC·Filed 2000·Granted Jan 7, 2003·53 cites·27 claims
- 0382US6477047B1Temperature sensor mounting for accurate measurement and durabilityADVANCED MICRO DEVICES INC·Filed 2000·Granted Nov 5, 2002·41 cites·25 claims
- 0428US2003085453A1Flip chip semiconductor devices and heat sink assemblies, and the coupling thereof to form an electronic apparatus including a compliant support for supporting a heat sinkADVANCE MICRO DEVICES INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →