Inventor · disambiguated record
Lester W. Herron
Also filed as: HERRON LESTER W · HERRON LESTER WYNN
46 granted patents·3 pending applications·1,448 citations·filing 1975–2007
99Inventor score
Files withIBM44CARBORUNDUM CO1CRYSTALLINE MATERIALS CORP1INTERNAT BUSSINESS MACHINES CO1UNIV ILLINOIS1
Top patents by PatentIndex Score
49 records- 0198US6528145B1Polymer and ceramic composite electronic substratesIBM·Filed 2000·Granted Mar 4, 2003·208 cites·30 claims
- 0295US4234367AMethod of making multilayered glass-ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1979·Granted Nov 18, 1980·91 cites·16 claims
- 0394US5130067AMethod and means for co-sintering ceramic/metal mlc substratesIBM·Filed 1986·Granted Jul 14, 1992·140 cites·21 claims
- 0493US7255153B2High performance integrated MLC cooling device for high power density ICS and method for manufacturingIBM·Filed 2005·Granted Aug 14, 2007·25 cites·17 claims
- 0592US4340436AProcess for flattening glass-ceramic substratesIBM·Filed 1980·Granted Jul 20, 1982·93 cites·24 claims
- 0690US5480503AProcess for producing circuitized layers and multilayer ceramic sub-laminates and composites thereofIBM·Filed 1993·Granted Jan 2, 1996·127 cites·11 claims
- 0782US5981310AMulti-chip heat-sink cap assemblyIBM·Filed 1998·Granted Nov 9, 1999·59 cites·11 claims
- 0882US5541005ALarge ceramic article and method of manufacturingIBM·Filed 1995·Granted Jul 30, 1996·64 cites·19 claims
- 0977US4753694AProcess for forming multilayered ceramic substrate having solid metal conductorsIBM·Filed 1986·Granted Jun 28, 1988·49 cites·7 claims
- 1076US6762119B2Method of preventing solder wetting in an optical device using diffusion of CrINTERNAT BUSSINESS MACHINES CO·Filed 2001·Granted Jul 13, 2004·23 cites·18 claims
- 1176US5108541AProcesses for electrically conductive decals filled with inorganic insulator materialIBM·Filed 1991·Granted Apr 28, 1992·67 cites·19 claims
- 1274US6124041ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1999·Granted Sep 26, 2000·35 cites·10 claims
- 1372US5338900AStructures for electrically conductive decals filled with inorganic insulator materialIBM·Filed 1992·Granted Aug 16, 1994·55 cites·20 claims
- 1471US4879156AMultilayered ceramic substrate having solid non-porous metal conductorsIBM·Filed 1988·Granted Nov 7, 1989·38 cites·12 claims
- 1571US4627160AMethod for removal of carbonaceous residues from ceramic structures having internal metallurgyIBM·Filed 1985·Granted Dec 9, 1986·38 cites·17 claims
- 1670US6373133B1Multi-chip module and heat-sink cap combinationIBM·Filed 1999·Granted Apr 16, 2002·34 cites·15 claims
- 1769US5541145ALow temperature sintering route for aluminum nitride ceramicsCARBORUNDUM CO·Filed 1995·Granted Jul 30, 1996·38 cites·60 claims
- 1858US6341417B1Pre-patterned substrate layers for being personalized as neededIBM·Filed 1999·Granted Jan 29, 2002·19 cites·15 claims
- 1956US5945735AHermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivityIBM·Filed 1997·Granted Aug 31, 1999·21 cites·15 claims
- 2056US4671928AMethod of controlling the sintering of metal particlesIBM·Filed 1984·Granted Jun 9, 1987·17 cites·6 claims
- 2154US5773377ALow temperature sintered, resistive aluminum nitride ceramicsCRYSTALLINE MATERIALS CORP·Filed 1995·Granted Jun 30, 1998·22 cites·50 claims
- 2251US6272957B1Flex die punching apparatus and methodIBM·Filed 2000·Granted Aug 14, 2001·2 cites·4 claims
- 2351US4971738AEnhanced removal of carbon from ceramic substrate laminatesIBM·Filed 1988·Granted Nov 20, 1990·16 cites·10 claims
- 2450US6037193AHermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivityIBM·Filed 1997·Granted Mar 14, 2000·16 cites·15 claims
- 2550US5925443ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1991·Granted Jul 20, 1999·14 cites·5 claims
- 2650US4776978AMethod of controlling the sintering of metal particlesIBM·Filed 1987·Granted Oct 11, 1988·16 cites·7 claims
- 2750US2008060792A1High performance integrated mlc cooling device for high power density ics and method for manufacturingIBM·Filed 2007·Application pending·0 cites
- 2849US4582722ADiffusion isolation layer for maskless cladding processIBM·Filed 1984·Granted Apr 15, 1986·9 cites·18 claims
- 2947US5763093AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Jun 9, 1998·10 cites·11 claims
- 3045US5682589AAluminum nitride body having graded metallurgyIBM·Filed 1996·Granted Oct 28, 1997·9 cites·12 claims
- 3145US5552107AAluminum nitride body having graded metallurgyIBM·Filed 1995·Granted Sep 3, 1996·9 cites·6 claims
- 3244US5932043AMethod for flat firing aluminum nitride/tungsten electronic modulesIBM·Filed 1997·Granted Aug 3, 1999·12 cites·53 claims
- 3343US5139975ASintering arrangement for enhancing removal of carbon from ceramic substrate laminatesIBM·Filed 1991·Granted Aug 18, 1992·12 cites·15 claims
- 3443US4598107AStepwise/ultimate density millingIBM·Filed 1985·Granted Jul 1, 1986·11 cites·10 claims
- 3541US5053361ASetter tile for use in sintering of ceramic substrate laminatesIBM·Filed 1990·Granted Oct 1, 1991·10 cites·4 claims
- 3640US4060662AArticle having a surface layer of catalytic ash by-product of coal combustionUNIV ILLINOIS·Filed 1975·Granted Nov 29, 1977·7 cites·14 claims
- 3740US2006157085A1Screening nest, method of screening wiring layers in a multi-layer ceramic and cleaning the screening mask and mask cleaning stationIBM·Filed 2005·Application pending·0 cites
- 3838US6475555B2Process for screening features on an electronic substrate with a low viscosity pasteIBM·Filed 1999·Granted Nov 5, 2002·7 cites·6 claims
- 3938US5888446AMethod of forming an aluminum nitride article utilizing a platinum catalystIBM·Filed 1998·Granted Mar 30, 1999·5 cites·11 claims
- 4038US2002023779A1Pre-patterned substrate layers for being personalized as neededFiled 2001·Application pending·0 cites
- 4137US6004624AMethod for the controlling of certain second phases in aluminum nitrideIBM·Filed 1997·Granted Dec 21, 1999·5 cites·6 claims
- 4234US6200373B1Method for controlling of certain second phases in aluminum nitrideIBM·Filed 1999·Granted Mar 13, 2001·3 cites·9 claims
- 4334US5552232AAluminum nitride body having graded metallurgyIBM·Filed 1994·Granted Sep 3, 1996·4 cites·10 claims
- 4431US5439636ALarge ceramic articles and method of manufacturingIBM·Filed 1992·Granted Aug 8, 1995·4 cites·26 claims
- 4531US4786674ADiffusion isolation layer for maskless cladding processIBM·Filed 1986·Granted Nov 22, 1988·2 cites·4 claims
- 4630US6358439B1Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1995·Granted Mar 19, 2002·1 cites·5 claims
- 4730US6116127AFlex die punching apparatus and methodIBM·Filed 1999·Granted Sep 12, 2000·1 cites·1 claims
- 4829US6306528B1Method for the controlling of certain second phases in aluminum nitrideIBM·Filed 1999·Granted Oct 23, 2001·0 cites·13 claims
- 4929US5974931AFlex die punching apparatus and methodIBM·Filed 1997·Granted Nov 2, 1999·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →