Inventor · disambiguated record
Leann G. Keim
Also filed as: KEIM LEANN G
2 granted patents·35 citations·filing 1991–1991
63Inventor score
Technology areasH10W
Files withIBM2
Top patents by PatentIndex Score
2 records- 0150US5108562AElectrolytic method for forming vias and through holes in copper-invar-copper core structuresIBM·Filed 1991·Granted Apr 28, 1992·21 cites·13 claims
- 0240US5176811AGold plating bath additives for copper circuitization on polyimide printed circuit boardsIBM·Filed 1991·Granted Jan 5, 1993·14 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →