Inventor · disambiguated record
Leon Lai
Also filed as: LAI LEON · LAI LEON LEE ON
2 granted patents·2 pending applications·8 citations·filing 2005–2023
46Inventor score
Top patents by PatentIndex Score
4 records- 0174US7098124B2Method of forming contact hole and method of fabricating semiconductor devicePOWERCHIP SEMICONDUCTOR CORP·Filed 2005·Granted Aug 29, 2006·8 cites·28 claims
- 0257US2025178999A1One step synthesis of 1-tetralone compounds and uses thereof in the preparation of (+)-tetralone abscisic acid (aba)UNIV SASKATCHEWAN·Filed 2023·Application pending·0 cites
- 0344US12063929B23′-alkynyl abscisic acid derivatives as ABA antagonistsUNIV SASKATCHEWAN·Filed 2019·Granted Aug 20, 2024·0 cites·22 claims
- 0437US2009217335A1Apparatus and methods for network accessWONG RICHARD SAI KIT·Filed 2009·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Leon Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →