Inventor · disambiguated record
Lee R. Levine
Also filed as: LEVINE LEE R · LEVINE LEE ROBERT
4 granted patents·1 pending application·156 citations·filing 1991–2005
81Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0174US5111989AMethod of making low profile fine wire interconnectionsKULICKE & SOFFA INVESTMENTS·Filed 1991·Granted May 12, 1992·60 cites·19 claims
- 0270US5205463AMethod of making constant clearance flat link fine wire interconnectionsKULICKE & SOFFA INVESTMENTS·Filed 1992·Granted Apr 27, 1993·54 cites·10 claims
- 0351US5176311AHigh yield clampless wire bonding methodKULICKE & SOFFA INVESTMENTS·Filed 1991·Granted Jan 5, 1993·25 cites·15 claims
- 0449US5884834AMulti-frequency ultrasonic wire bonder and methodKULICKE & SOFFA INVESTMENTS·Filed 1996·Granted Mar 23, 1999·17 cites·15 claims
- 0534US2006186179A1Apparatus and method for bonding wiresLEVINE LEE R·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →