Inventor · disambiguated record
Leping Li
Also filed as: LI LEPING
53 granted patents·3 pending applications·2,179 citations·filing 1991–2014
99Inventor score
Top patents by PatentIndex Score
56 records- 0198US6126848AIndirect endpoint detection by chemical reaction and chemiluminescenceIBM·Filed 1998·Granted Oct 3, 2000·485 cites·13 claims
- 0297US5559428AIn-situ monitoring of the change in thickness of filmsIBM·Filed 1995·Granted Sep 24, 1996·258 cites·19 claims
- 0395US6072313AIn-situ monitoring and control of conductive films by detecting changes in induced eddy currentsIBM·Filed 1997·Granted Jun 6, 2000·163 cites·12 claims
- 0495US5660672AIn-situ monitoring of conductive films on semiconductor wafersIBM·Filed 1995·Granted Aug 26, 1997·155 cites·64 claims
- 0595US5644221AEndpoint detection for chemical mechanical polishing using frequency or amplitude modeIBM·Filed 1996·Granted Jul 1, 1997·135 cites·18 claims
- 0692US5731697AIn-situ monitoring of the change in thickness of filmsIBM·Filed 1996·Granted Mar 24, 1998·108 cites·13 claims
- 0788US5220405AInterferometer for in situ measurement of thin film thickness changesIBM·Filed 1991·Granted Jun 15, 1993·65 cites·24 claims
- 0882US5392124AMethod and apparatus for real-time, in-situ endpoint detection and closed loop etch process controlIBM·Filed 1993·Granted Feb 21, 1995·52 cites·40 claims
- 0980US5659492AChemical mechanical polishing endpoint process controlIBM·Filed 1996·Granted Aug 19, 1997·60 cites·24 claims
- 1078US6228280B1Endpoint detection by chemical reaction and reagentIBM·Filed 1998·Granted May 8, 2001·51 cites·9 claims
- 1176US5788801AReal time measurement of etch rate during a chemical etching processIBM·Filed 1997·Granted Aug 4, 1998·49 cites·6 claims
- 1272US5381234AMethod and apparatus for real-time film surface detection for large area wafersIBM·Filed 1993·Granted Jan 10, 1995·36 cites·23 claims
- 1371US6276987B1Chemical mechanical polishing endpoint process controlIBM·Filed 1998·Granted Aug 21, 2001·32 cites·35 claims
- 1471US6213846B1Real-time control of chemical-mechanical polishing processes using a shaft distortion measurementIBM·Filed 1999·Granted Apr 10, 2001·37 cites·7 claims
- 1571US5770948ARotary signal coupling for chemical mechanical polishing endpoint detection with a strasbaugh toolIBM·Filed 1996·Granted Jun 23, 1998·36 cites·14 claims
- 1669US9352442B2Lapping carrierSEAGATE TECHNOLOGY LLC·Filed 2013·Granted May 31, 2016·4 cites·20 claims
- 1768US5663637ARotary signal coupling for chemical mechanical polishing endpoint detection with a westech toolIBM·Filed 1996·Granted Sep 2, 1997·41 cites·22 claims
- 1866US6440263B1Indirect endpoint detection by chemical reaction and chemiluminescenceIBM·Filed 2000·Granted Aug 27, 2002·8 cites·5 claims
- 1966US5516399AContactless real-time in-situ monitoring of a chemical etchingIBM·Filed 1994·Granted May 14, 1996·40 cites·18 claims
- 2065US5501766AMinimizing overetch during a chemical etching processIBM·Filed 1994·Granted Mar 26, 1996·26 cites·15 claims
- 2165US5386121AIn situ, non-destructive CVD surface monitorIBM·Filed 1993·Granted Jan 31, 1995·24 cites·14 claims
- 2264US5456788AMethod and apparatus for contactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1995·Granted Oct 10, 1995·25 cites·10 claims
- 2363US6899784B1Apparatus for detecting CMP endpoint in acidic slurriesECOPHYSICS AG·Filed 2002·Granted May 31, 2005·13 cites·8 claims
- 2462US6878629B1Method for detecting CMP endpoint in acidic slurriesIBM·Filed 2002·Granted Apr 12, 2005·8 cites·13 claims
- 2562US5338390AContactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1992·Granted Aug 16, 1994·32 cites·14 claims
- 2657US6291351B1Endpoint detection in chemical-mechanical polishing of cloisonne structuresIBM·Filed 2000·Granted Sep 18, 2001·6 cites·14 claims
- 2756US5573624AChemical etch monitor for measuring film etching uniformity during a chemical etching processIBM·Filed 1994·Granted Nov 12, 1996·26 cites·10 claims
- 2856US5445705AMethod and apparatus for contactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1994·Granted Aug 29, 1995·22 cites·10 claims
- 2954US8767351B1Ambient temperature ball bondSEAGATE TECHNOLOGY LLC·Filed 2013·Granted Jul 1, 2014·1 cites·20 claims
- 3054US6989683B2Enhanced endpoint detection for wet etch process controlIBM·Filed 2004·Granted Jan 24, 2006·3 cites·6 claims
- 3153US5582746AReal time measurement of etch rate during a chemical etching processIBM·Filed 1994·Granted Dec 10, 1996·19 cites·11 claims
- 3253US5500073AReal time measurement of etch rate during a chemical etching processIBM·Filed 1995·Granted Mar 19, 1996·15 cites·15 claims
- 3352US6254453B1Optimization of chemical mechanical process by detection of oxide/nitride interface using CLD systemIBM·Filed 1999·Granted Jul 3, 2001·17 cites·6 claims
- 3450US9308622B2Lapping head with a sensor device on the rotating lapping headSEAGATE TECHNOLOGY LLC·Filed 2013·Granted Apr 12, 2016·0 cites·16 claims
- 3550US6741913B2Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection systemIBM·Filed 2001·Granted May 25, 2004·5 cites·16 claims
- 3650US6419785B1Endpoint detection by chemical reactionIBM·Filed 2000·Granted Jul 16, 2002·2 cites·5 claims
- 3748US9478237B2Work piece contact pad with centering featureSEAGATE TECHNOLOGY LLC·Filed 2013·Granted Oct 25, 2016·0 cites·20 claims
- 3848US6843880B2Enhanced endpoint detection for wet etch process controlIBM·Filed 2002·Granted Jan 18, 2005·1 cites·7 claims
- 3947US6261851B1Optimization of CMP process by detecting of oxide/nitride interface using IR systemIBM·Filed 1999·Granted Jul 17, 2001·12 cites·15 claims
- 4046US6066564AIndirect endpoint detection by chemical reactionIBM·Filed 1998·Granted May 23, 2000·12 cites·15 claims
- 4146US5489361AMeasuring film etching uniformity during a chemical etching processIBM·Filed 1994·Granted Feb 6, 1996·15 cites·5 claims
- 4246US5480511AMethod for contactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1994·Granted Jan 2, 1996·13 cites·18 claims
- 4345US9115980B2Row bar thickness measurement device, system and methodsSEAGATE TECHNOLOGY LLC·Filed 2013·Granted Aug 25, 2015·0 cites·20 claims
- 4445US5451289AFixture for in-situ noncontact monitoring of wet chemical etching with passive wafer restraintIBM·Filed 1994·Granted Sep 19, 1995·15 cites·1 claims
- 4544US6835117B1Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern densityIBM·Filed 2003·Granted Dec 28, 2004·2 cites·18 claims
- 4642US6021679AProbe for slurry gas samplingIBM·Filed 1998·Granted Feb 8, 2000·11 cites·12 claims
- 4741US6228769B1Endpoint detection by chemical reaction and photoionizationIBM·Filed 1998·Granted May 8, 2001·8 cites·8 claims
- 4841US5573623AApparatus for contactless real-time in-situ monitoring of a chemical etching processIBM·Filed 1995·Granted Nov 12, 1996·7 cites·38 claims
- 4938US6180422B1Endpoint detection by chemical reactionIBM·Filed 1998·Granted Jan 30, 2001·5 cites·14 claims
- 5037US2015260757A1Probe tip structure for bondingless electronic lapping guide connectionsSEAGATE TECHNOLOGY LLC·Filed 2014·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Leping Li files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →