Inventor · disambiguated record
Leo Li
Also filed as: LI LEO · LI LEO ZHAOQING
3 granted patents·4 pending applications·10 citations·filing 2009–2025
61Inventor score
Top patents by PatentIndex Score
7 records- 0189US9714317B2Adhesive composition for temporarily bonding use in wafer manufacturingHENKEL AG & CO KGAA·Filed 2014·Granted Jul 25, 2017·6 cites·15 claims
- 0276US2025357449A1Chip-on-wafer-on-board structure using spacer die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0367US8354488B2Reactive surfactants and their use in emulsions and dispersionsRHODIA OPERATIONS·Filed 2009·Granted Jan 15, 2013·4 cites·32 claims
- 0466US11873368B2Two component (2K) composition based on modified epoxy resinHENKEL AG & CO KGAA·Filed 2021·Granted Jan 16, 2024·0 cites·14 claims
- 0562US2023420429A1Chip-on-wafer-on-board structure using spacer die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0661US2022017743A1Photo-curable compositions for additive manufacturingHENKEL AG & CO KGAA·Filed 2021·Application pending·0 cites
- 0755US2024297087A1Package module with a module stiffener and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →