Inventor · disambiguated record
Lejie Liu
Also filed as: LIU LEJIE
0 granted patents·5 pending applications·0 citations·filing 2023–2024
Top patents by PatentIndex Score
5 records- 0163US2024413054A1Integrated circuit packages with fluid spacers to improve pin load distributionINTEL CORP·Filed 2024·Application pending·0 cites
- 0262US2025055217A1Pins for use in land grid arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 0361US2025089192A1Composite backplate architectures for backside power delivery and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0458US2024133945A1Modular low level contact resistance testing apparatus for processor socketsPRABHUGOUD MOHANRAJ·Filed 2023·Application pending·0 cites
- 0555US2024179832A1Multi-entry socket power delivery structure and backplateGENG PHIL·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →