Inventor · disambiguated record
Lee B. Max
Also filed as: MAX LEE B · MAX LEE BENAT
6 granted patents·6 pending applications·155 citations·filing 1974–2008
86Inventor score
Top patents by PatentIndex Score
12 records- 0181US4193083APackage for push-pull semiconductor devicesVARIAN ASSOCIATES·Filed 1978·Granted Mar 11, 1980·46 cites·14 claims
- 0275US4242598ATemperature compensating transistor bias deviceVARIAN ASSOCIATES·Filed 1974·Granted Dec 30, 1980·20 cites·18 claims
- 0372US4107728APackage for push-pull semiconductor devicesVARIAN ASSOCIATES·Filed 1977·Granted Aug 15, 1978·32 cites·31 claims
- 0461US6056186AMethod for bonding a ceramic to a metal with a copper-containing shimBRUSH WELLMAN·Filed 1997·Granted May 2, 2000·33 cites·19 claims
- 0547US5760473ASemiconductor package having a eutectic bonding layerBRUSH WELLMAN·Filed 1996·Granted Jun 2, 1998·18 cites·18 claims
- 0644US6529081B1Method of operating a solid state power amplifying deviceZETA DIVISION OF SIERRA TECH I·Filed 2000·Granted Mar 4, 2003·6 cites·26 claims
- 0741US2010013559A1High frequency amplifying deviceMAX LEE B·Filed 2008·Application pending·0 cites
- 0829US2003089994A1Soild state power amplifying deviceFiled 2002·Application pending·0 cites
- 0929US2003089995A1Solid state power amplifying deviceFiled 2002·Application pending·0 cites
- 1028US2002013048A1Solid state power amplifying deviceFiled 2001·Application pending·0 cites
- 1128US2003062954A1Method of operating a solid state power amplifying deviceFiled 2002·Application pending·0 cites
- 1225US2001038140A1High rigidity, multi-layered semiconductor package and method of making the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →