Inventor · disambiguated record
Leah M. Miller
Also filed as: MILLER LEAH · MILLER LEAH M
21 granted patents·1 pending application·230 citations·filing 2001–2008
95Inventor score
Top patents by PatentIndex Score
22 records- 0193US6701270B1Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the sourceLSI LOGIC CORP·Filed 2001·Granted Mar 2, 2004·67 cites·20 claims
- 0285US6762366B1Ball assignment for ball grid array packageLSI LOGIC CORP·Filed 2001·Granted Jul 13, 2004·39 cites·18 claims
- 0373US7791210B2Semiconductor package having discrete non-active electrical components incorporated into the packageLSI CORP·Filed 2003·Granted Sep 7, 2010·20 cites·16 claims
- 0473US6744130B1Isolated stripline structureLSI LOGIC CORP·Filed 2003·Granted Jun 1, 2004·18 cites·20 claims
- 0571US7298036B2Scaling of functional assignments in packagesLSI CORP·Filed 2005·Granted Nov 20, 2007·5 cites·3 claims
- 0664US7829424B2Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designsLSI CORP·Filed 2008·Granted Nov 9, 2010·2 cites·3 claims
- 0763US6459049B1High density signal routingLSI LOGIC CORP·Filed 2001·Granted Oct 1, 2002·14 cites·16 claims
- 0862US7993741B2Preventing damage with separatorsCARDINAL CG CO·Filed 2002·Granted Aug 9, 2011·5 cites·18 claims
- 0961US6858930B2Multi chip moduleLSI LOGIC CORP·Filed 2003·Granted Feb 22, 2005·8 cites·18 claims
- 1059US7508062B2Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designsLSI CORP·Filed 2005·Granted Mar 24, 2009·1 cites·9 claims
- 1159US7062742B2Routing structure for transceiver coreLSI LOGIC CORP·Filed 2003·Granted Jun 13, 2006·9 cites·20 claims
- 1258US7051434B2Designing a ball assignment for a ball grid array packageLSI LOGIC CORP·Filed 2003·Granted May 30, 2006·7 cites·9 claims
- 1358US6791177B1Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrateLSI LOGIC CORP·Filed 2003·Granted Sep 14, 2004·8 cites·19 claims
- 1457US6963129B1Multi-chip package having a contiguous heat spreader assemblyLSI LOGIC CORP·Filed 2003·Granted Nov 8, 2005·8 cites·6 claims
- 1557US6680532B1Multi chip moduleLSI LOGIC CORP·Filed 2002·Granted Jan 20, 2004·6 cites·7 claims
- 1653US7267880B2Presence indicator for removable transparent filmCARDINAL CG CO·Filed 2004·Granted Sep 11, 2007·1 cites·55 claims
- 1753US6445066B1Splitting and assigning power planesLSI LOGIC CORP·Filed 2001·Granted Sep 3, 2002·6 cites·7 claims
- 1849US6768386B1Dual clock package optionLSI LOGIC CORP·Filed 2003·Granted Jul 27, 2004·3 cites·20 claims
- 1949US2007231553A1Removable protective coverCARDINAL CG CO·Filed 2007·Application pending·0 cites
- 2043US7414322B2High speed interface designLSI CORP·Filed 2005·Granted Aug 19, 2008·0 cites·18 claims
- 2142US6534968B1Integrated circuit test vehicleLSI LOGIC CORP·Filed 2001·Granted Mar 18, 2003·3 cites·20 claims
- 2241US7319272B2Ball assignment systemLSI LOGIC CORP·Filed 2005·Granted Jan 15, 2008·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →