Inventor · disambiguated record
Lee Fee Ngion
Also filed as: NGION LEE FEE
3 granted patents·9 citations·filing 2014–2018
61Inventor score
Top patents by PatentIndex Score
3 records- 0179US9209147B1Method of forming pillar bumpFOONG CHEE SENG·Filed 2014·Granted Dec 8, 2015·6 cites·13 claims
- 0266US10654709B1Shielded semiconductor device and lead frame thereforNXP USA INC·Filed 2018·Granted May 19, 2020·1 cites·20 claims
- 0356US9209144B1Substrate with electrically isolated bond padsNGION LEE FEE·Filed 2014·Granted Dec 8, 2015·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →