Inventor · disambiguated record
Le Hoai Bao Nguyen
Also filed as: NGUYEN LE HOAI BAO
1 granted patent·1 pending application·0 citations·filing 2022–2022
4Inventor score
Technology areasH10W
Files withINTEL CORP2
Top patents by PatentIndex Score
2 records- 0144US2024217122A1Enhanced substrate transfer arm (sta) and pedestal of thermal compression bonding (tcb) and integrated process using thereofINTEL CORP·Filed 2022·Application pending·0 cites
- 0243US12500112B2Nozzle and bond head heater of thermal compression bonding (TCB) tool and die attachment process using thereofINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →