Inventor · disambiguated record
Lesley A. Polka Wood
Also filed as: POLKA WOOD LESLEY A
2 granted patents·1 pending application·11 citations·filing 2009–2020
52Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0182US8110920B2In-package microelectronic apparatus, and methods of using sameDATTAGURU SRIRAM·Filed 2009·Granted Feb 7, 2012·11 cites·2 claims
- 0245US8354748B2In-package microelectronic apparatus, and methods of using sameINTEL CORP·Filed 2012·Granted Jan 15, 2013·0 cites·7 claims
- 0340US2021296241A1Microelectronic package with reduced through-substrate routingINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →