Inventor · disambiguated record
Lee Rockford
Also filed as: ROCKFORD LEE · ROCKFORD LEE D
9 granted patents·3 pending applications·173 citations·filing 2002–2024
88Inventor score
Top patents by PatentIndex Score
12 records- 0194US7018918B2Method of forming a selectively converted inter-layer dielectric using a porogen materialINTEL CORP·Filed 2003·Granted Mar 28, 2006·76 cites·13 claims
- 0290US6943121B2Selectively converted inter-layer dielectricINTEL CORP·Filed 2002·Granted Sep 13, 2005·43 cites·12 claims
- 0387US6699798B2Promoting adhesion of fluoropolymer films to semiconductor substratesINTEL CORP·Filed 2002·Granted Mar 2, 2004·33 cites·18 claims
- 0475US7145245B2Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—thereinINTEL CORP·Filed 2005·Granted Dec 5, 2006·4 cites·6 claims
- 0573US6964919B2Low-k dielectric film with good mechanical strengthINTEL CORP·Filed 2002·Granted Nov 15, 2005·13 cites·11 claims
- 0668US7239019B2Selectively converted inter-layer dielectricINTEL CORP·Filed 2005·Granted Jul 3, 2007·2 cites·14 claims
- 0759US7579070B2Multiple layer deposition for improving adhesionINTEL CORP·Filed 2005·Granted Aug 25, 2009·2 cites·8 claims
- 0859US2025300077A1End-to-end reduction between semiconductor interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US2025112150A1Integrated circuit structures having registration marks for dual-sided devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 1034US8129767B2Ferroelectric polymer memory moduleROCKFORD LEE D·Filed 2010·Granted Mar 6, 2012·0 cites·7 claims
- 1134US7808024B2Ferroelectric polymer memory moduleINTEL CORP·Filed 2004·Granted Oct 5, 2010·0 cites·7 claims
- 1231US2007003695A1Method of manufacturing a polymer memory deviceTREGUB ALEXANDER·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lee Rockford files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →