Inventor · disambiguated record
Lee-Cheng Shen
Also filed as: SHEN LEE-CHENG
8 granted patents·4 pending applications·40 citations·filing 2003–2022
82Inventor score
Top patents by PatentIndex Score
12 records- 0180US7436683B2Wafer level packaging structure with inductors and manufacture method thereofIND TECH RES INST·Filed 2006·Granted Oct 14, 2008·12 cites·14 claims
- 0279US7319050B2Wafer level chip scale packaging structure and method of fabricating the sameIND TECH RES INST·Filed 2005·Granted Jan 15, 2008·8 cites·6 claims
- 0370US6998718B2Wafer level chip scale packaging structure and method of fabricating the sameIND TECH RES INST·Filed 2004·Granted Feb 14, 2006·15 cites·12 claims
- 0464US11869850B2Package structure comprising conductive metal board and ground elementWISTRON NEWEB CORP·Filed 2022·Granted Jan 9, 2024·0 cites·2 claims
- 0556US8228083B2Testing system and testing methodSHEN LEE-CHENG·Filed 2009·Granted Jul 24, 2012·4 cites·15 claims
- 0653US2021398911A1Package structure and method for manufacturing the sameWISTRON NEWEB CORP·Filed 2020·Application pending·0 cites
- 0749US8692721B2Wireless communicating device and portable electronic apparatus using the sameHSIEH TSUNG-YING·Filed 2010·Granted Apr 8, 2014·1 cites·10 claims
- 0844US8039935B2Wafer level chip scale packaging structure and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Oct 18, 2011·0 cites·7 claims
- 0942US2008014679A1Packaging structure with protective layers and packaging method thereofIND TECH RES INST·Filed 2006·Application pending·0 cites
- 1038US2004218848A1Flexible electronic/optical interconnection film assembly and method for manufacturingIND TECH RES INST·Filed 2003·Application pending·0 cites
- 1137US2013201650A1Molded radio-frequency structure with selective electromagnetic shielding and forming method thereofSHEN LEE-CHENG·Filed 2012·Application pending·0 cites
- 1236US11410901B2Package structure and manufacturing method thereofWISTRON NEWEB CORP·Filed 2020·Granted Aug 9, 2022·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →