Inventor · disambiguated record
Leigh M. Tribolet
Also filed as: TRIBOLET LEIGH M
4 granted patents·1 pending application·5 citations·filing 2017–2024
64Inventor score
Technology areasH10W
Files withINTEL CORP5
Top patents by PatentIndex Score
5 records- 0185US11694959B2Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2019·Granted Jul 4, 2023·3 cites·25 claims
- 0279US2025029929A1Multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2024·Application pending·0 cites
- 0378US12142568B2Multi-die ultrafine pitch patch architecture of interconnect bridge over glass layer and method of makingINTEL CORP·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 0468US10290569B2Constrained cure component attach process for improved IC package warpage controlINTEL CORP·Filed 2017·Granted May 14, 2019·2 cites·15 claims
- 0547US11756889B2Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of makingINTEL CORP·Filed 2019·Granted Sep 12, 2023·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →