Inventor · disambiguated record

Lee-Chuan Tseng

Also filed as: TSENG LEE-CHUAN

57 granted patents·13 pending applications·79 citations·filing 2009–2025

97Inventor score

Technology areasH10P H10W B81C B81B H10D

Files withTAIWAN SEMICONDUCTOR MFG CO LTD67 KUO CHRIS1 NANYA TECHNOLOGY CORP1 TAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

70 records

0198US9567208B1Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·17 cites·19 claims
0295US10483119B1Self-aligned double patterning (SADP) methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 19, 2019·11 cites·20 claims
0393US11996308B2Method for mapping wafers in a wafer carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·2 cites·20 claims
0493US10526199B1High efficiency getter design in vacuum MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 7, 2020·6 cites·20 claims
0593US9567207B2Recess with tapered sidewalls for hermetic seal in MEMS devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 14, 2017·7 cites·20 claims
0691US9224615B2Noble gas bombardment to reduce scallops in bosch etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 29, 2015·12 cites·20 claims
0790US10029910B1Formation method of MEMS device structure with cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 24, 2018·5 cites·20 claims
0888US10562763B2Fence structure to prevent stiction in a MEMS motion sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 18, 2020·3 cites·20 claims
0988US2025327973A1Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1087US2025316457A1Ion beam etching chamber with etching by-product redistributorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1186US2024363777A1Dielectric sidewall structure for quality improvement in ge and sige devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1285US12345920B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
1385US10048220B2Biosensor field effect transistor having specific well structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 14, 2018·2 cites·18 claims
1484US12424419B2Ion beam etching chamber with etching by-product redistributorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
1583US12094989B2Dielectric sidewall structure for quality improvement in Ge and SiGe devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
1683US10784091B2Process and related device for removing by-product on semiconductor processing chamber sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·2 cites·20 claims
1783US2024331988A1Process and related device for removing by-product on semiconductor processing chamber sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
1882US10147829B2Dielectric sidewall structure for quality improvement in Ge and SiGe devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 4, 2018·2 cites·20 claims
1981US2025296835A1Comb electrode release process for mems structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2078US12358785B2Comb electrode release process for MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
2178US11675129B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 13, 2023·0 cites·20 claims
2277US12362154B2Ion beam etching chamber with etching by-product redistributorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
2376US11167982B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·20 claims
2476US2025316579A1Etch stop structure for ic to increase stability and enduranceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2575US10872777B2Self-aligned double patterning (SADP) methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·1 cites·20 claims
2675US9944516B2High aspect ratio etch without upper wideningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 17, 2018·2 cites·20 claims
2775US2024266196A1Method for mapping wafers in a wafer carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2875US2024371668A1Sonar sensor in processing chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2975US2024379400A1Wafer chuck structure with holes in upper surface to improve temperature uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3074US12391545B2Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 19, 2025·0 cites·20 claims
3174US11749763B2Dielectric sidewall structure for quality improvement in Ge and SiGe devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
3274US9466541B2Mechanism for MEMS bump side wall angle improvementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 11, 2016·2 cites·16 claims
3372US12027350B2Process and related device for removing by-product on semiconductor processing chamber sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 2, 2024·0 cites·20 claims
3472US11710622B2Process and related device for removing by-product on semiconductor processing chamber sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 25, 2023·0 cites·20 claims
3572US10683204B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
3671US10037893B1Method and apparatus for etching wafer with etching gasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·1 cites·20 claims
3770US11921325B2Semiconductor device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
3870US9434076B2Robot blade designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 6, 2016·2 cites·20 claims
3969US11661337B2Comb electrode release process for MEMS structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·0 cites·20 claims
4069US10870574B2Method and apparatus for reducing in-process and in-use stiction for MEMS devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
4168US10875764B2High efficiency getter design in vacuum MEMS deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·0 cites·20 claims
4268US2024021513A1Etch stop structure for ic to increase stability and enduranceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
4367US12136556B2Sonar sensor in processing chamberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 5, 2024·0 cites·20 claims
4467US11542153B2Segmented pedestal for mounting device on chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·20 claims
4566US10273143B2Method and apparatus for reducing in-process and in-use stiction for MEMS devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·20 claims
4665US11261083B2Fence structure to prevent stiction in a MEMS motion sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
4765US10322930B2Semiconductor arrangement and formation thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 18, 2019·0 cites·20 claims
4864US12272585B2Wafer chuck structure with holes in upper surface to improve temperature uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·20 claims
4964US9606081B2Method for fabricating a micro-well of a biosensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 28, 2017·1 cites·20 claims
5063US10896985B2Dielectric sidewall structure for quality improvement in GE and SIGE devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 19, 2021·0 cites·20 claims

Showing the top 50 of 70 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →