Inventor · disambiguated record
Leo Van Gemert
Also filed as: VAN GEMERT LEO
13 granted patents·2 pending applications·11 citations·filing 2009–2023
84Inventor score
Top patents by PatentIndex Score
15 records- 0180US10615134B2Integrated circuit packageNXP BV·Filed 2018·Granted Apr 7, 2020·4 cites·12 claims
- 0272US10109564B2Wafer level chip scale semiconductor packageNXP BV·Filed 2017·Granted Oct 23, 2018·2 cites·20 claims
- 0370US10825789B1Underbump metallization dimension variation with improved reliabilityNXP BV·Filed 2019·Granted Nov 3, 2020·2 cites·21 claims
- 0467US10315821B2Component carrierNXP BV·Filed 2016·Granted Jun 11, 2019·1 cites·18 claims
- 0566US12183595B2Selective underfill assembly and method thereforNXP BV·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 0660US8679963B2Fan-out chip scale packageNXP BV·Filed 2013·Granted Mar 25, 2014·2 cites·14 claims
- 0755US11963291B2Efficient wave guide transition between package and PCB using solder wallNXP BV·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 0855US11557491B2Selective underfill assembly and method thereforNXP BV·Filed 2019·Granted Jan 17, 2023·0 cites·16 claims
- 0954US2024088068A1Semiconductor device with through package via and method thereforNXP USA INC·Filed 2022·Application pending·0 cites
- 1050US12476355B2SystemNXP BV·Filed 2023·Granted Nov 18, 2025·0 cites·18 claims
- 1149US2024014152A1Semiconductor device with under-bump metallization and method thereforNXP BV·Filed 2022·Application pending·0 cites
- 1244US10613136B2Apparatus comprising a semiconductor arrangementNXP BV·Filed 2018·Granted Apr 7, 2020·0 cites·15 claims
- 1343US11508669B2Method and apparatus for improved circuit structure thermal reliability on printed circuit board materialsNXP BV·Filed 2019·Granted Nov 22, 2022·0 cites·17 claims
- 1443US8482136B2Fan-out chip scale packageGULPEN JAN·Filed 2009·Granted Jul 9, 2013·0 cites·23 claims
- 1533US11011446B2Semiconductor device and method of making a semiconductor deviceNexperia BV·Filed 2016·Granted May 18, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →