Inventor · disambiguated record
Lejun Wang
Also filed as: WANG LEJUN
20 granted patents·5 pending applications·242 citations·filing 1999–2021
94Inventor score
Files withINTEL CORP7MEDTRONIC INC6GEORGIA TECH RES INST3JHM ENGINEERING AND TECH NINGBO CO LTD2ASKARINYA MOHSEN1
Top patents by PatentIndex Score
25 records- 0191US7179684B2Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill materialINTEL CORP·Filed 2005·Granted Feb 20, 2007·19 cites·19 claims
- 0289US6644536B2Solder reflow with microwave energyINTEL CORP·Filed 2001·Granted Nov 11, 2003·53 cites·13 claims
- 0388US6899960B2Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill materialINTEL CORP·Filed 2002·Granted May 31, 2005·23 cites·19 claims
- 0486US8824161B2Integrated circuit packaging for implantable medical devicesASKARINYA MOHSEN·Filed 2012·Granted Sep 2, 2014·9 cites·12 claims
- 0584US6172141B1Reworkable epoxy underfill encapsulantsGEORGIA TECH RES INST·Filed 1999·Granted Jan 9, 2001·39 cites·21 claims
- 0680US8750961B1Implantable medical device having a multi-axis magnetic sensorMEDTRONIC INC·Filed 2013·Granted Jun 10, 2014·16 cites·20 claims
- 0778US6570029B2No-flow reworkable epoxy underfills for flip-chip applicationsGEORGIA TECH RES INST·Filed 2001·Granted May 27, 2003·26 cites·28 claims
- 0875US9607759B2Implantable medical device including a molded planar transformerMEDTRONIC INC·Filed 2013·Granted Mar 28, 2017·3 cites·17 claims
- 0975US7359211B2Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making sameINTEL CORP·Filed 2004·Granted Apr 15, 2008·16 cites·28 claims
- 1073US6730542B2Polybenzoxazine based wafer-level underfill materialINTEL CORP·Filed 2003·Granted May 4, 2004·16 cites·13 claims
- 1166US11844628B2Method of forming a transformer assemblyMEDTRONIC INC·Filed 2020·Granted Dec 19, 2023·0 cites·17 claims
- 1264US6727594B2Polybenzoxazine based wafer-level underfill materialINTEL CORP·Filed 2002·Granted Apr 27, 2004·10 cites·13 claims
- 1364US6498260B2Thermally degradable epoxy underfills for flip-chip applicationsGEORGIA TECH RES INST·Filed 2001·Granted Dec 24, 2002·12 cites·26 claims
- 1460US2017086740A1Implantable medical device including a molded planar transformerMEDTRONIC INC·Filed 2016·Application pending·0 cites
- 1555US2008150099A1Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making sameLANDEROS JUAN·Filed 2008·Application pending·0 cites
- 1653US12116703B2Method of preparing PAN-based carbon fibersTIANGONG UNIV·Filed 2021·Granted Oct 15, 2024·0 cites·9 claims
- 1752US12083718B2Preparation method of high-rate foamed polylactic acid (PLA) sheetJHM ENGINEERING AND TECH NINGBO CO LTD·Filed 2019·Granted Sep 10, 2024·0 cites·9 claims
- 1851US9496241B2Integrated circuit packaging for implantable medical devicesMEDTRONIC INC·Filed 2014·Granted Nov 15, 2016·0 cites·10 claims
- 1951US2007117263A1Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill materialSHI SONG-HUA·Filed 2007·Application pending·0 cites
- 2050US12454086B2Method and device for directly preparing foamed polylactic acid (PLA) product from PLA meltJHM ENGINEERING AND TECH NINGBO CO LTD·Filed 2019·Granted Oct 28, 2025·0 cites·7 claims
- 2150US2014275915A1Implantable medical device including a molded planar transformerMEDTRONIC INC·Filed 2013·Application pending·0 cites
- 2241US8133583B2Fire retardant antiflux fiber and its production processTIAN SUFENG·Filed 2007·Granted Mar 13, 2012·0 cites·7 claims
- 2338US11213690B2Wafer level packages of high voltage units for implantable medical devicesBOONE MARK R·Filed 2012·Granted Jan 4, 2022·0 cites·19 claims
- 2438US7199342B2Self-aligned mechanical joint between die and substrate exposed to mixed microwave energyINTEL CORP·Filed 2003·Granted Apr 3, 2007·0 cites·4 claims
- 2534US2019185715A1Polishing liquid for cmp and preparation method and use thereofBEIJING CHUANGYU TECH CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →