Inventor · disambiguated record
Lee Shuang Wang
Also filed as: WANG LEE SHUANG
13 granted patents·10 pending applications·15 citations·filing 2016–2025
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
23 records- 0194US11876028B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 16, 2024·2 cites·20 claims
- 0288US9922910B2Functionalized interface structureINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Mar 20, 2018·7 cites·24 claims
- 0380US12094793B2Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 0480US11676881B2Semiconductor package, semiconductor assembly and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·1 cites·20 claims
- 0578US2024395646A1Package with electrically insulated carrier and at least one step on encapsulantINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0675US10147703B2Semiconductor package for multiphase circuitry deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 4, 2018·3 cites·23 claims
- 0772US10204845B2Semiconductor chip package having a repeating footprint patternINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 0857US2024222234A1Package with low-warpage carrierINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0956US2025201754A1Semiconductor device comprising a carrier, a semiconductor die and a c-shaped clip connected between themINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1056US2024312936A1Power semiconductor package including a passive electronic component and method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1155US2025118637A1Package carrier with large back side areaINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1254US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1352US11348866B2Package and lead frame design for enhanced creepage and clearanceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted May 31, 2022·0 cites·20 claims
- 1452US2023361009A1Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1550US11011456B2Lead frames including lead posts in different planesINFINEON TECHNOLOGIES AG·Filed 2019·Granted May 18, 2021·0 cites·20 claims
- 1649US11804424B2Method for fabricating a semiconductor device by using different connection methods for the semiconductor die and the clipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 1749US11355424B2Multi-chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 7, 2022·0 cites·18 claims
- 1849US2025357232A1Semiconductor package including an encapsulant with a peripheral side wall having a recess and a lead disposed in the recessINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 1948US2025308942A1Method of forming a die package and die packageINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 2046US2022108949A1Semiconductor packages including a u-shaped railINFINEON TECHNOLOGIES AG·Filed 2020·Application pending·0 cites
- 2139US10840164B2Wire bonded package with single piece exposed heat slug and leadsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Nov 17, 2020·0 cites·18 claims
- 2237US11362023B2Package lead design with grooves for improved dambar separationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 14, 2022·0 cites·17 claims
- 2334US2016365296A1Electronic Devices with Increased Creepage DistancesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lee Shuang Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →