Inventor · disambiguated record
Lester Wilson
Also filed as: WILSON LESTER · WILSON LESTER L
11 granted patents·5 pending applications·147 citations·filing 1998–2005
90Inventor score
Files withTEXAS INSTRUMENTS INC11
Top patents by PatentIndex Score
16 records- 0193US6906539B2High density, area array probe card apparatusTEXAS INSTRUMENTS INC·Filed 2001·Granted Jun 14, 2005·63 cites·18 claims
- 0276US6720574B2Method of testing a semiconductor chipTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 13, 2004·23 cites·20 claims
- 0373US6636063B2Probe card with contact apparatus and method of manufactureTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 21, 2003·18 cites·22 claims
- 0464US6553661B2Semiconductor test structure having a laser defined current carrying structureTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 29, 2003·10 cites·20 claims
- 0561US6209532B1Soft handling process tooling for low and medium volume known good die productTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 3, 2001·8 cites·18 claims
- 0654US6376352B1Stud-cone bump for probe tips used in known good die carriersTEXAS INSTRUMENTS INC·Filed 1999·Granted Apr 23, 2002·15 cites·16 claims
- 0751US6489673B2Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriersTEXAS INSTRUMENTS INC·Filed 2001·Granted Dec 3, 2002·5 cites·20 claims
- 0843US2005140382A1High density, area array probe card apparatusFiled 2005·Application pending·0 cites
- 0941US7122895B2Stud-cone bump for probe tips used in known good die carriersTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 17, 2006·1 cites·8 claims
- 1039US6335226B1Digital signal processor/known good die packaging using rerouted existing package for test and burn-in carriersTEXAS INSTRUMENTS INC·Filed 2000·Granted Jan 1, 2002·1 cites·12 claims
- 1136US2003088975A1Semiconductor test structure having a laser defined current carrying structureFiled 2002·Application pending·0 cites
- 1236US2003116346A1Low cost area array probe for circuits having solder-ball contacts are manufactured using a wire bonding machineFiled 2001·Application pending·0 cites
- 1335US6720780B2High density probe card apparatus and method of manufactureTEXAS INSTRUMENTS INC·Filed 2001·Granted Apr 13, 2004·0 cites·25 claims
- 1435US2004169521A1High density probe card apparatus and method of manufactureFiled 2004·Application pending·0 cites
- 1534US2003094962A1Dual plane probe card assembly and method of manufactureFiled 2001·Application pending·0 cites
- 1631US7898275B1Known good die using existing process infrastructureTEXAS INSTRUMENTS INC·Filed 1998·Granted Mar 1, 2011·3 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →