Inventor · disambiguated record
Le Yao
Also filed as: YAO LE
5 granted patents·2 pending applications·0 citations·filing 2018–2022
58Inventor score
Files withIBM3INFOUCUS PREC INDUSTRY SHENZHEN CO LTD1INTEL CORP1SHENZHEN NEXT GENERATION COMMUNICATIONS LTD1UNIV CHINESE HONG KONG SHENZHEN1
Top patents by PatentIndex Score
7 records- 0166US11845821B2Humidity-stiffening polymer material, and preparation method therefor and use thereofUNIV CHINESE HONG KONG SHENZHEN·Filed 2022·Granted Dec 19, 2023·0 cites·8 claims
- 0249US11799945B2Pipelined file server based data transmissionIBM·Filed 2021·Granted Oct 24, 2023·0 cites·17 claims
- 0348US11762708B2Decentralized resource schedulingIBM·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 0446US2023185624A1Adaptive framework to manage workload execution by computing device including one or more acceleratorsINTEL CORP·Filed 2022·Application pending·0 cites
- 0539US2024020171A1Resource and workload schedulingIBM·Filed 2022·Application pending·0 cites
- 0638US11724597B2Vehicle-mounted displaying method, device and vehicleSHENZHEN NEXT GENERATION COMMUNICATIONS LTD·Filed 2020·Granted Aug 15, 2023·0 cites·14 claims
- 0734US10762874B2Electronic device and method for controlling displayINFOUCUS PREC INDUSTRY SHENZHEN CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →