Inventor · disambiguated record
Lee-Sheng Yen
Also filed as: YEN LEE-SHENG
8 granted patents·5 pending applications·7 citations·filing 2010–2016
79Inventor score
Top patents by PatentIndex Score
13 records- 0173US8987060B2Method for making circuit boardADVANCE MATERIALS CORP·Filed 2013·Granted Mar 24, 2015·3 cites·6 claims
- 0268US8748234B2Method for making circuit boardYEN LEE-SHENG·Filed 2012·Granted Jun 10, 2014·2 cites·7 claims
- 0358US8698008B2Packaging substrate and fabrication method thereofYEN LEE-SHENG·Filed 2011·Granted Apr 15, 2014·1 cites·4 claims
- 0452US8628636B2Method of manufacturing a package substrateYEN LEE-SHENG·Filed 2012·Granted Jan 14, 2014·1 cites·10 claims
- 0549US8742567B2Circuit board structure and packaging structure comprising the circuit board structureYEN LEE-SHENG·Filed 2012·Granted Jun 3, 2014·0 cites·4 claims
- 0646US8836108B2Circuit board structure and package structureYEN LEE-SHENG·Filed 2010·Granted Sep 16, 2014·0 cites·4 claims
- 0745US9084341B2Fabrication method of packaging substrateADVANCE MATERIALS CORP·Filed 2014·Granted Jul 14, 2015·0 cites·9 claims
- 0840US8102063B2Pad structure with a nano-structured coating filmYEN LEE-SHENG·Filed 2010·Granted Jan 24, 2012·0 cites·27 claims
- 0940US2015171296A1Light emitting package and carrier structure thereforYEN LEE-SHENG·Filed 2014·Application pending·0 cites
- 1039US2015147535A1LaminateYEN LEE-SHENG·Filed 2013·Application pending·0 cites
- 1133US2011260340A1Circuit board structure, packaging structure and method for making the sameYEN LEE-SHENG·Filed 2010·Application pending·0 cites
- 1231US2017301842A1Light emitting package structureTEAM EXPERT MAN CONSULTING SERVICE LTD·Filed 2016·Application pending·0 cites
- 1331US2017271267A1Semiconductor packaging structureTEAM EXPERT MAN CONSULTING SERVICE LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →