Inventor · disambiguated record
Lim T. Beng
Also filed as: BENG LIM T
3 granted patents·188 citations·filing 1994–1995
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0183US5466888APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1995·Granted Nov 14, 1995·72 cites·6 claims
- 0279US5563443APackaged semiconductor device utilizing leadframe attached on a semiconductor chipTEXAS INSTRUMENTS INC·Filed 1995·Granted Oct 8, 1996·92 cites·6 claims
- 0358US5406028APackaged semiconductor device having stress absorbing filmHITACHI LTD·Filed 1994·Granted Apr 11, 1995·24 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →