Inventor · disambiguated record

Lien Chia Chang

Also filed as: CHANG LIEN CHIA

1 granted patent·2 pending applications·2 citations·filing 2017–2024

17Inventor score

Technology areasH10W

Files withPOWERTECH TECHNOLOGY INC3

Top patents by PatentIndex Score

3 records

0165US9991206B1Package method including forming electrical paths through a mold layerPOWERTECH TECHNOLOGY INC·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
0256US2025210593A1Stacked package device with interconnected substratesPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
0356US2025210482A1Stacked package device with interconnected conductive bumpsPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when Lien Chia Chang files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →