Inventor · disambiguated record
Liangbiao Chen
Also filed as: CHEN LIANGBIAO
9 granted patents·4 pending applications·6 citations·filing 2019–2025
80Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC13
Top patents by PatentIndex Score
13 records- 0194US11121055B2Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Sep 14, 2021·4 cites·15 claims
- 0292US12278158B2Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Apr 15, 2025·1 cites·20 claims
- 0385US11830784B2Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Nov 28, 2023·1 cites·20 claims
- 0481US12417957B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 0580US2025391728A1Leadframe spacer for double-sided power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0677US2024355638A1Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0774US11842942B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Dec 12, 2023·0 cites·21 claims
- 0870US12062549B2Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Aug 13, 2024·0 cites·10 claims
- 0967US11282764B2Structure and method related to a power module using a hybrid spacerSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 22, 2022·0 cites·20 claims
- 1061US11075090B2Semiconductor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jul 27, 2021·0 cites·4 claims
- 1160US11562938B2Spacer with pattern layout for dual side cooling power moduleSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Jan 24, 2023·0 cites·18 claims
- 1256US2024371659A1Package with molding cavitySEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 1356US2024282668A1Protection dam for a power module with spacersSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Liangbiao Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →