Inventor · disambiguated record
Liu Chen
Also filed as: CHEN LIU · CHEN LIU-YUAN
13 granted patents·151 citations·filing 1994–2023
89Inventor score
Top patents by PatentIndex Score
13 records- 0192US9681558B2Module with integrated power electronic circuitry and logic circuitryINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 13, 2017·24 cites·13 claims
- 0286US5747735AGrounding clip for IC cardsMOLEX INC·Filed 1997·Granted May 5, 1998·60 cites·5 claims
- 0382US9564423B2Power package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·5 cites·17 claims
- 0476US9564578B2Semiconductor package with integrated magnetic field sensorINFINEON TECHNOLOGIES AG·Filed 2015·Granted Feb 7, 2017·3 cites·20 claims
- 0575US9385059B2Overmolded substrate-chip arrangement with heat sinkINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 5, 2016·3 cites·19 claims
- 0673US5421737AUniversal ejector mechanism for an IC card connector apparatusMOLEX INC·Filed 1994·Granted Jun 6, 1995·53 cites·10 claims
- 0768US11903132B2Power electronic assembly having a laminate inlay and method of producing the power electronic assemblyINFINEON TECHNOLOGIES AG·Filed 2023·Granted Feb 13, 2024·0 cites·20 claims
- 0866US10727151B2Semiconductor chip package having a cooling surface and method of manufacturing a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 28, 2020·2 cites·13 claims
- 0961US10168391B2Multi-functional interconnect module and carrier with multi-functional interconnect module attached theretoINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 1, 2019·1 cites·25 claims
- 1055US11632860B2Power electronic assembly and method of producing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Apr 18, 2023·0 cites·20 claims
- 1143US10290567B2Transistor package with three-terminal clipINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 14, 2019·0 cites·19 claims
- 1242US11239127B2Topside-cooled semiconductor package with molded standoffINFINEON TECHNOLOGIES AG·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 1341US11127853B2Power transistor device including first and second transistor cells having different on-resistances for improved thermal stabilityINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 21, 2021·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →