Inventor · disambiguated record

Li-Hui Cheng

Also filed as: CHENG LI-HUI

110 granted patents·53 pending applications·401 citations·filing 2011–2025

99Inventor score

Technology areasH10W H10P B22F H01L C23C

Files withTAIWAN SEMICONDUCTOR MFG CO LTD155 HWANG KUEN-SHYANG3 TAIWAN SEMICONDUCTOR MFG3 TAIWAN POWDER TECH CO LTD1 TAIWAN POWDER TECHNOLOGIES CO LTD1

Top patents by PatentIndex Score

163 records

0199US11488843B2Underfill between a first package and a second packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·6 cites·20 claims
0299US10170341B1Release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·37 cites·20 claims
0398US11521905B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·5 cites·20 claims
0498US11239136B1Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 1, 2022·7 cites·20 claims
0598US10504824B1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·44 cites·20 claims
0698US9378982B2Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die packageTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 28, 2016·45 cites·20 claims
0798US9159678B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·42 cites·18 claims
0897US11996345B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·4 cites·20 claims
0997US11626344B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 11, 2023·4 cites·20 claims
1097US11456287B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·5 cites·20 claims
1197US9425121B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·25 cites·20 claims
1296US10763132B2Release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·11 cites·19 claims
1396US9583420B2Semiconductor device and method of manufacturesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·14 cites·20 claims
1495US11756802B2Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
1595US11296051B2Semiconductor packages and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 5, 2022·9 cites·20 claims
1695US10079225B2Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 18, 2018·10 cites·20 claims
1795US9761566B1Multi-die structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·11 cites·20 claims
1894US9929128B1Chip package structure with adhesive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 27, 2018·9 cites·20 claims
1993US12170236B2Method for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·1 cites·20 claims
2093US12033912B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 9, 2024·2 cites·20 claims
2193US11830821B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·2 cites·20 claims
2292US11923259B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·1 cites·20 claims
2392US11804468B2Manufacturing method of semiconductor package using jigTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
2492US10103132B2Semiconductor device and method of manufacturesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·7 cites·20 claims
2591US11855003B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·2 cites·20 claims
2691US11424174B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·2 cites·20 claims
2791US10438934B1Package-on-package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 8, 2019·6 cites·20 claims
2890US10269587B2Integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·4 cites·20 claims
2990US9633934B2Semicondutor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Apr 25, 2017·8 cites·20 claims
3089US11302683B2Optical signal processing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·2 cites·20 claims
3188US10553569B2Multi-die structure and method for forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 4, 2020·4 cites·20 claims
3288US9633895B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·4 cites·20 claims
3388US2025316570A1Method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3487US10134719B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 20, 2018·4 cites·20 claims
3587US10008485B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 26, 2018·4 cites·20 claims
3687US9142432B2Integrated fan-out package structures with recesses in molding compoundTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 22, 2015·5 cites·20 claims
3786US11705381B2High efficiency heat dissipation using thermal interface material filmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·1 cites·20 claims
3886US11527418B2Integrated circuit packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·1 cites·20 claims
3986US9646918B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted May 9, 2017·5 cites·20 claims
4086US9455211B2Integrated fan-out structure with openings in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 27, 2016·8 cites·18 claims
4185US12300574B2Adhesive and thermal interface material on a plurality of dies covered by a lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted May 13, 2025·0 cites·20 claims
4285US10290610B2PoP device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·4 cites·20 claims
4385US2025140768A1Method of forming package structure and package structure therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4484US11869822B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 9, 2024·1 cites·20 claims
4584US10522476B2Package structure, integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 31, 2019·4 cites·20 claims
4683US12368084B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
4783US12218117B2Method of forming package structure and package structure therefromTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
4883US2025316563A1Methods of packaging semiconductor devices and packaged semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4982US2025316554A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
5082US2024363365A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

Showing the top 50 of 163 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →