Inventor · disambiguated record
Lien-Chen Chiang
Also filed as: CHIANG LIEN-CHEN
6 granted patents·4 pending applications·326 citations·filing 2000–2015
83Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD9
Top patents by PatentIndex Score
10 records- 0195US6476469B2Quad flat non-leaded package structure for housing CMOS sensorSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 5, 2002·277 cites·13 claims
- 0282US7180161B2Lead frame for improving molding reliability and semiconductor package with the lead frameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2005·Granted Feb 20, 2007·11 cites·20 claims
- 0379US6696749B1Package structure having tapering support bars and leadsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Feb 24, 2004·33 cites·11 claims
- 0457US7459770B2Lead frame structure having blocking surfaces and semiconductor package integrated with the lead frame structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Granted Dec 2, 2008·2 cites·8 claims
- 0545US6642735B2Semiconductor package for chip with testing contact pad connected to outsideSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Nov 4, 2003·3 cites·16 claims
- 0644US2008308951A1Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 0743US9355989B2Wire bonding device and method of eliminating defective bonding wireSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted May 31, 2016·0 cites·10 claims
- 0831US2002060358A1Package of an image sensor deviceFiled 2001·Application pending·0 cites
- 0930US2016141217A1Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 1030US2016126176A1Package substrate, package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →