Inventor · disambiguated record
Lien Wah Choong
Also filed as: CHOONG LIEN WAH
3 granted patents·28 citations·filing 2001–2019
64Inventor score
Files withMICRON TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0170US6656769B2Method and apparatus for distributing mold material in a mold for packaging microelectronic devicesMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 2, 2003·26 cites·7 claims
- 0269US10199299B1Semiconductor mold compound transfer system and associated methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 5, 2019·2 cites·18 claims
- 0364US10658256B2Semiconductor mold compound transfer system and associated methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 19, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →