Inventor · disambiguated record
Li-Huan Chu
Also filed as: CHU LI-HUAN
29 granted patents·2 pending applications·105 citations·filing 1997–2024
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD27TAIWAN SEMICONDUCTOR MFG2TSMC SOLAR LTD1YANG HSUAN-SHENG1
Top patents by PatentIndex Score
31 records- 0192US10892230B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 12, 2021·6 cites·20 claims
- 0292US10283424B1Wafer structure and packaging methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 7, 2019·10 cites·20 claims
- 0392US10163827B1Package structure with protrusion structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·7 cites·20 claims
- 0491US11404383B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0590US10510633B1Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 0689US10373901B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·5 cites·20 claims
- 0787US11315860B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 26, 2022·5 cites·20 claims
- 0887US10867881B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 0985US10506712B1Printed circuit boardTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·19 claims
- 1080US12205859B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 1178US12237226B2Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1275US11990423B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1375US2024395621A1Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1474US5999011AMethod of fast testing of hot carrier effectsTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 7, 1999·40 cites·10 claims
- 1573US11081392B2Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
- 1673US10912194B2Printed circuit boardTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 1772US11610827B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·0 cites·20 claims
- 1869US11127704B2Semiconductor device with bump structure and method of making semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 21, 2021·1 cites·20 claims
- 1968US11742276B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 2068US11101190B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·1 cites·19 claims
- 2164US12051624B2Stacked semiconductor devices and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 2262US12159847B2Integrated fan-out structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·20 claims
- 2360US12016126B2Carrier tape system and components and methods of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 2460US11527499B2Integrated fan-out structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 2558US11239143B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
- 2658US2015000723A1High efficiency photovoltaic systemTSMC SOLAR LTD·Filed 2013·Application pending·0 cites
- 2755US10692828B2Package structure with protrusion structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 2851US11342291B2Semiconductor packages with crack preventing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2950US11240947B2Carrier tape system and components and methods of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·18 claims
- 3049US5981347AMultiple thermal annealing method for a metal oxide semiconductor field effect transistor with enhanced hot carrier effect (HCE) resistanceTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Nov 9, 1999·16 cites·5 claims
- 3134US9018032B2CIGS solar cell structure and method for fabricating the sameYANG HSUAN-SHENG·Filed 2012·Granted Apr 28, 2015·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →