Inventor · disambiguated record
Li-Hsin Chu
Also filed as: CHU LI · CHU LI-HSIN
27 granted patents·13 pending applications·21 citations·filing 2013–2025
93Inventor score
Top patents by PatentIndex Score
40 records- 0192US10777591B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·4 cites·21 claims
- 0290US11488993B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·2 cites·20 claims
- 0390US10679889B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 9, 2020·5 cites·20 claims
- 0489US2025359368A1Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0585US11195720B2Method for ion implantation that adjusts a target's tilt angle based on a distribution of ejected ions from a targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 7, 2021·2 cites·20 claims
- 0683US12439713B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0783US2025318294A1Germanium-based photodetector with reduced dark current and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0882US12051593B2Method for an ion implantation process employing an ion-collecting device that collects a distribution of ejected ions from a target to correct a tilt angle of the targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 0982US9281336B2Mechanisms for forming backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 8, 2016·2 cites·20 claims
- 1082US2024405035A1Germanium-based photodetector with reduced dark current and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1182US2024347341A1Method for ion implantation that adjusts a target's tilt angle based on a distribution of ejected ions from a targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1280US2025151376A1Device including mim capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1379US12211838B2Device including MIM capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 28, 2025·0 cites·20 claims
- 1479US11784199B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 1577US11615961B2Method for ion implantation that adjusts a targets tilt angle based on a distribution of ejected ions from a targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 1677US2022384503A1Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1777US2025355096A1Method for making an image sensor for time-of-flight systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1875US9673248B2Image sensing device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 6, 2017·3 cites·20 claims
- 1973US10438838B2Semiconductor structure and related methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 8, 2019·1 cites·20 claims
- 2073US2025081642A1Photodetector with reduced dark current sensitivity and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2171US12364036B2Germanium-based photodetector with reduced dark currentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 15, 2025·0 cites·20 claims
- 2271US11756955B2Device including MIM capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 2370US11587824B2Method for manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 21, 2023·0 cites·20 claims
- 2469US9620551B2Mechanisms for forming backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 11, 2017·1 cites·20 claims
- 2565US12191328B2Photodetector with reduced dark current sensitivity and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 7, 2025·0 cites·20 claims
- 2665US11476288B2Infrared image sensor component manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 18, 2022·0 cites·20 claims
- 2763US11127625B2Semiconductor structure and related methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 2862US9524997B1Semiconductor device having seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 20, 2016·1 cites·20 claims
- 2961US9871067B2Infrared image sensor componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 16, 2018·0 cites·16 claims
- 3060US10453881B2Infrared image sensor componentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 3159US2023065710A1Image sensor for time-of-flight system and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3259US2025344438A1Semiconductor devices having contact field plates and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3358US9287303B1CMOS image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 15, 2016·0 cites·20 claims
- 3456US9627249B2Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 18, 2017·0 cites·20 claims
- 3555US10553489B2Partitioned wafer and semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 4, 2020·0 cites·20 claims
- 3652US9905466B2Wafer partitioning method and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 27, 2018·0 cites·20 claims
- 3752US2024353877A1Energy storage container temperature control method, apparatus and electronic deviceCORNEX NEW ENERGY CO LTD·Filed 2023·Application pending·0 cites
- 3851US9691807B2CMOS image sensor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·0 cites·20 claims
- 3950US2023411193A1Automated material handling system for use in power outage recoveryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4038US2019148370A1Device including mim capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →