Inventor · disambiguated record
Lipu Kris Chuang
Also filed as: CHUANG LIPU KRIS
16 granted patents·13 pending applications·33 citations·filing 2017–2025
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD29
Top patents by PatentIndex Score
29 records- 0197US11450581B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·11 cites·20 claims
- 0296US11749640B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0396US10510713B1Semicondcutor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·12 cites·20 claims
- 0494US11984372B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·2 cites·20 claims
- 0592US11205636B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·20 claims
- 0687US2024387498A1Manufacturing method of semiconductor package with thermal relaxation blockTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0785US10811384B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 0884US12255196B2Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0980US2025183245A1Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1079US2025357443A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1178US11830866B2Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 1278US2025357455A1Package structure with heat spreader layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1377US2025357261A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1476US10720416B2Semiconductor package including thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·1 cites·20 claims
- 1575US2025349814A1Integrated circuit packages with thermal reservoir dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1674US2025299973A1Staggered metal mesh on backside of device die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1772US11309302B2Manufacturing method of semiconductor package including thermal conductive blockTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
- 1871US2025210609A1Package structure with heat spreader layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1970US2025210608A1Integrated circuit packages with thermal reservoir dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2070US2025323120A1Semiconductor package with localized hot spot cooling solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2170US2025210451A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2269US11018113B2Memory module, semiconductor package including the same, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·1 cites·20 claims
- 2368US12438007B2Staggered metal mesh on backside of device die and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 2468US2025233046A1Semiconductor package with localized hot spot cooling solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2564US2023343764A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2657US12400936B2Stacked memory cube with integrated thermal path for enhanced heat dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2750US11551999B2Memory device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 10, 2023·0 cites·16 claims
- 2849US10672681B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 2945US10256203B2Semiconductor device and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 9, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →