Inventor · disambiguated record
Lih-Ming Doong
Also filed as: DOONG LIH-MING
2 granted patents·2 pending applications·1 citations·filing 2007–2018
30Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0152US8659128B2Flip chip package structure with heat dissipation enhancement and its applicationYANG YU-LIN·Filed 2011·Granted Feb 25, 2014·1 cites·4 claims
- 0242US2009051019A1Multi-chip module packageHUANG CHIH-FENG·Filed 2007·Application pending·0 cites
- 0341US2012217657A1Multi-chip module packageHUANG CHIH-FENG·Filed 2012·Application pending·0 cites
- 0432US11170926B2Isolated coupling structureALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2018·Granted Nov 9, 2021·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →