Inventor · disambiguated record
Lisa A. Fanti
Also filed as: FANTI LISA A
11 granted patents·1 pending application·454 citations·filing 1997–2005
92Inventor score
Files withIBM12
Top patents by PatentIndex Score
12 records- 0190US6622907B2Sacrificial seed layer process for forming C4 solder bumpsIBM·Filed 2002·Granted Sep 23, 2003·78 cites·20 claims
- 0288US6015505AProcess improvements for titanium-tungsten etching in the presence of electroplated C4'sIBM·Filed 1997·Granted Jan 18, 2000·88 cites·6 claims
- 0388US5935402AProcess for stabilizing organic additives in electroplating of copperIBM·Filed 1998·Granted Aug 10, 1999·58 cites·8 claims
- 0483US6468413B1Electrochemical etch for high tin solder bumpsIBM·Filed 2000·Granted Oct 22, 2002·19 cites·21 claims
- 0582US6258627B1Underfill preform interposer for joining chip to substrateIBM·Filed 1999·Granted Jul 10, 2001·69 cites·50 claims
- 0682US5904156ADry film resist removal in the presence of electroplated C4'sIBM·Filed 1997·Granted May 18, 1999·74 cites·9 claims
- 0772US6130170AProcess improvements for titanium-tungsten etching in the presence of electroplated C4'sIBM·Filed 1999·Granted Oct 10, 2000·36 cites·7 claims
- 0870US5908540ACopper anode assembly for stabilizing organic additives in electroplating of copperIBM·Filed 1997·Granted Jun 1, 1999·22 cites·9 claims
- 0962US6995475B2I/C chip suitable for wire bondingIBM·Filed 2003·Granted Feb 7, 2006·9 cites·3 claims
- 1046US7572726B2Method of forming a bond pad on an I/C chip and resulting structureIBM·Filed 2005·Granted Aug 11, 2009·0 cites·15 claims
- 1141US6900142B2Inhibition of tin oxide formation in lead free interconnect formationIBM·Filed 2003·Granted May 31, 2005·1 cites·9 claims
- 1234US2002190028A1Method of improving uniformity of etching of a film on an articleIBM·Filed 2001·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Lisa A. Fanti files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →