Inventor · disambiguated record
Li-Han Hsu
Also filed as: HSU LI-HAN
97 granted patents·21 pending applications·2,007 citations·filing 2008–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD59SEVILLE CLASSICS INC49CHANG EDWARD YI2HO EDWIN2UNIV NAT CHIAO TUNG2
Top patents by PatentIndex Score
118 records- 0199US11508695B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·7 cites·20 claims
- 0299US10062648B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 28, 2018·70 cites·19 claims
- 0399US9997464B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 12, 2018·64 cites·20 claims
- 0499USD808690SUtility rackSEVILLE CLASSICS INC·Filed 2016·Granted Jan 30, 2018·119 cites·1 claims
- 0599US9741690B1Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 22, 2017·52 cites·20 claims
- 0698US9425126B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·883 cites·20 claims
- 0797US9247809B1Connector for modular rack assemblySEVILLE CLASSICS INC·Filed 2015·Granted Feb 2, 2016·26 cites·7 claims
- 0896US10475768B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 12, 2019·11 cites·20 claims
- 0996US9502343B1Dummy metal with zigzagged edgesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 22, 2016·14 cites·20 claims
- 1095US9833066B2Connector for modular rack assemblySEVILLE CLASSICS INC·Filed 2016·Granted Dec 5, 2017·17 cites·9 claims
- 1195US9812426B1Integrated fan-out package, semiconductor device, and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 7, 2017·19 cites·20 claims
- 1294US11515229B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·3 cites·20 claims
- 1393US11756870B2Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 1493US11564487B2Connector for modular rack assemblySEVILLE CLASSICS INC·Filed 2021·Granted Jan 31, 2023·3 cites·10 claims
- 1591USD696049SBasket organizerSEVILLE CLASSICS INC·Filed 2013·Granted Dec 24, 2013·45 cites·1 claims
- 1691US7967156B2Storage rackSEVILLE CLASSICS INC·Filed 2008·Granted Jun 28, 2011·24 cites·15 claims
- 1789US12322726B2Method of forming an integrated circuit package having a padding layer on a carrierTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·1 cites·20 claims
- 1889US10165682B2Opening in the pad for bonding integrated passive device in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 25, 2018·4 cites·10 claims
- 1988US11581268B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 14, 2023·1 cites·20 claims
- 2088US10950577B2Redistribution layers in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 16, 2021·3 cites·20 claims
- 2186US10714426B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 14, 2020·3 cites·20 claims
- 2286USD792099SMesh basketSEVILLE CLASSICS INC·Filed 2015·Granted Jul 18, 2017·27 cites·1 claims
- 2386USD703467SModular utility rackHO EDWIN·Filed 2013·Granted Apr 29, 2014·33 cites·1 claims
- 2485US11013318B2Connector for modular rack assemblySEVILLE CLASSICS INC·Filed 2020·Granted May 25, 2021·2 cites·10 claims
- 2585USD704482SShelf organizerSEVILLE CLASSICS INC·Filed 2013·Granted May 13, 2014·30 cites·1 claims
- 2684US12506087B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 2784USD787242SShoe rackSEVILLE CLASSICS INC·Filed 2016·Granted May 23, 2017·23 cites·1 claims
- 2884USD762402SModular utility rackSEVILLE CLASSICS INC·Filed 2015·Granted Aug 2, 2016·25 cites·1 claims
- 2983USD843792SPan rackSEVILLE CLASSICS INC·Filed 2016·Granted Mar 26, 2019·22 cites·1 claims
- 3083USD703468SModular utility rackHO EDWIN·Filed 2013·Granted Apr 29, 2014·27 cites·1 claims
- 3183USD699485SModular utility rackSEVILLE CLASSICS INC·Filed 2013·Granted Feb 18, 2014·29 cites·1 claims
- 3282US11018088B2Dummy features in redistribution layers (RDLS) and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 25, 2021·2 cites·20 claims
- 3382US10398224B2Connector for modular rack assemblySEVILLE CLASSICS INC·Filed 2017·Granted Sep 3, 2019·4 cites·10 claims
- 3481US9754831B2Dummy structure for chip-on-wafer-on-substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·3 cites·20 claims
- 3581USD732323SModular utility rackSEVILLE CLASSICS INC·Filed 2013·Granted Jun 23, 2015·25 cites·1 claims
- 3681US2025087550A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3780US11955439B2Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 3880US10629537B2Conductive vias in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 21, 2020·2 cites·20 claims
- 3980USD830792SDrawer organizerSEVILLE CLASSICS INC·Filed 2017·Granted Oct 16, 2018·16 cites·1 claims
- 4080US2025096092A1Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4180US2025105090A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4279US11612057B2Opening in the pad for bonding integrated passive device in InFO packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 21, 2023·0 cites·20 claims
- 4379US2025357234A1PACKAGING OF DIES INCLUDING TSVs USING SACRIFICIAL CARRIERTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4479US2025357383A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4578US12191239B2Stacked via structure disposed on a conductive pillar of a semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 7, 2025·0 cites·20 claims
- 4678US10504751B2Package structures and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·2 cites·20 claims
- 4778USD745781SBinSEVILLE CLASSICS INC·Filed 2014·Granted Dec 22, 2015·21 cites·1 claims
- 4878USD716590SStep shelfSEVILLE CLASSICS INC·Filed 2014·Granted Nov 4, 2014·21 cites·1 claims
- 4978US2025329666A1Stress buffer in integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 5078US2025357367A1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 118 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →